Device-cable assembly integrally molded with resin

专利名称：Device-cable assembly integrally molded

with resin

发明人：Akihiro Tanba,Keiichi Ohuchi申请号：US12775509申请日：20100507公开号：US08242370B2公开日：20120814

专利附图：

摘要：A device-cable assembly integrally molded with a resin according to the presentinvention comprises: the electric/electronic device; the cable including: a cable sheathwhich is the outermost layer of the cable, the cable sheath being made of a mixture of a

fluorocarbon-based polymer and a polyolefin-based copolymer, and fine silica particlesthat are deposited on the surface of the cable sheath by CCVD (combustion chemicalvapor deposition); and the molded resin which integrally covers the electric/electronicdevice and the cable together, the molded resin being made of a polyamide-based resin.

申请人：Akihiro Tanba,Keiichi Ohuchi

地址：Hitachinaka JP,Hitachinaka JP

国籍：JP,JP

代理机构：Antonelli, Terry, Stout & Kraus, LLP.

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