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专利名称：Multilayered printed wiring board and its
manufacture
发明人：Yasue, Toshihiko,Hiramatsu, Yasuji,Yano,
Hideki,Ishitani, Yoshifumi,Kawamura,Yoichiro,Murase, Hideki,Suzuki,Ayumi,Kawade, Masato
申请号：EP06017888.6申请日：19960329公开号：EP1720393A2公开日：20061108
专利附图：
摘要：It is to provide a multilayer printed circuit board having excellent resolution,interlaminar insulation property and resistance to cool-heat shock without formingunevenness on the surface and lowering peel strength even if the thickness of the resininsulating layer is thin. The invention proposes a multilayer printed circuit board
comprising a lower conductor circuit layer formed on a substrate, a resin insulating layer
formed on the lower conductor circuit layer, an upper conductor circuit layer formed onthe resin insulating layer, and a viahole formed in the resin insulating layer for electricallyconnecting the lower conductor circuit layer and the upper conductor circuit layer,wherein the resin insulating layer is comprised of a composite layer of thermosettingresin and thermoplastic resin.
申请人：IBIDEN CO., LTD.
地址：1, Kanda-cho 2-chome Ogaki-shi, Gifu 503-0917 JP
国籍：JP
代理机构：Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
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