Electronically integrated vehicle structure

专利名称：Electronically integrated vehicle structure发明人：Andrew Z. Glovatsky,Jay D. Baker,Richard

Keith McMillan,Myron Lemecha,Daniel RogerVander Sluis

申请号：US10828396申请日：20040420公开号：US07102888B2公开日：20060905

专利附图：

摘要：An integrated vehicle structure includes an electronic site in a plastic supportstructure. The electronic site has a flexible substrate with electronic components

mounted thereon. The plastic support structure defines a plastic mounting surface whichincludes a plurality of elongated ribs projecting from the plastic support structure. Eachof the ribs have a side edge forming a portion of the plastic mounting surface. Theflexible substrate is mounted to the plastic mounting surface, and a plurality of air flowpassageways are defined by adjacent ribs in the flexible substrate. A method supportstructure may also be provided which defines a metal mounting surface. One or moreelectronic sides may be attached to the metal and plastic mounting surfaces.

申请人：Andrew Z. Glovatsky,Jay D. Baker,Richard Keith McMillan,MyronLemecha,Daniel Roger Vander Sluis

地址：Plymouth MI US,West Bloomfield MI US,Dearborn MI US,Dearborn MIUS,Plymouth MI US

国籍：US,US,US,US,US

代理机构：Brinks Hofer Gilson & Lione

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