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ELECTRICALLY CONDUCTIVE COMPOSITIONS AND METHODS F

来源:华佗小知识
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专利名称:ELECTRICALLY CONDUCTIVE

COMPOSITIONS AND METHODS FOR THEPREPARATION AND USE THEREOF

发明人:CAPOTE, Miguel, Albert,TODD, Michael,

George,MANESIS, Nicholas, John,CRAIG,Hugh, P.

申请号:EP929210.8申请日:19921001公开号:EP06048B1公开日:20060118

摘要:Electrically conductive adhesive compositions and methods for the preparationand use thereof, in which a solder powder, a chemically protected cross-linking agentwith fluxing properties and a reactive monomer or polymer are the principal components.Depending upon the intended end use, the compositions comprise three or more of thefollowing: a relatively high melting metal powder; solder powder; the active cross-linkingagent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer.The compositions are useful as improved conductive adhesives, such as for attachingelectrical components to electrical circuits; the compositions comprising metal powderare ideally suited for creating the conductive paths on printed circuits. The compositionsfor forming conductive paths may first be applied to a substrate in the desired pattern ofan electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes themetals, enabling sintering to occur between the metal powder and the solder powder.

申请人:TORANAGA TECHNOLOGIES, INC.

代理机构:Orès, Bernard

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