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专利名称：Connection structural member and
connection structural member module, andprobe card assembly and wafer testingapparatus using the same
发明人：Jun-hee Lee申请号：US15175023申请日：20160606公开号：US09793635B2公开日：20171017
专利附图：
摘要：An apparatus comprising: a barrel having an first hole and a second hole
opposite to the first hole; a first plunger disposed in the first hole and including a hookshape; a second plunger disposed in the second hole; and an elastic connection memberdisposed within the barrel to connect the first plunger and the second plunger.
申请人：Samsung Electronics Co., Ltd.
地址：Suwon-si, Gyeonggi-do KR
国籍：KR
代理机构：Renaissance IP Law Group LLP
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