Introduction
TAJ – Standard SeriesTAJ – Low Profile Series
TPS – High Performance, Low ESRTACmicrochip
TAZ – Specialist SeriesCWR09 MIL-C-55365/4CWR11 MIL-C-55365/8
Technical Summary & Application GuidelinesPackaging
Questions & AnswersTechnical PublicationsFax Back Form
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1
Introduction
AVX Tantalum
AVX Paignton is the Divisional Headquarters for the Tantalumdivision which has manufacturing locations in Paignton in theUK, Biddeford in Maine, USA, Juarez in Mexico, Lanskrounin the Czech Republic and El Salvador.
The Division takes its name from the raw material used tomake its main products, Tantalum Capacitors. Tantalum is
an element extracted from ores found alongside tin and niobium deposits; the major sources of supply are Canada,Brazil and Australasia.
So for high volume tantalum capacitors with leading edgetechnology call us first - AVX your global partner.
TECHNOLOGY TRENDS
The amount of capacitance possible in a tantalum capacitoris directly related to the type of tantalum powder used tomanufacture the anode.
The graph following shows how the CV/g has steadilyincreased over time, thus allowing the production of largerand larger capacitances with the same physical volume.CV/g is the measure used to define the volumetric efficiencyof a powder, a high CV/g means a higher capacitance fromthe same volume.
These improvements in the powder have been achievedthrough close development with the material suppliers.
AVX Tantalum is committed to driving the available technologyforwards as is clearly identified by the new TACmicrochiptechnology and the standard codes under development.If you have any specific requirements, please contact yourlocal AVX sales office for details on how AVX Tantalum canassist you in addressing your future requirements.
Tantalum Powder CV/gm
807060504030201001975
CV/g ('000s)1980
19851990
Year
19952000
WORKING WITH THE CUSTOMER- ONE STOP SHOPPING
In line with our desire to become the number one supplier inthe world for passive and interconnection components, AVXconstantly feels the need to look forward and innovate.
It is not good enough to market the best products, the customer must have access to a service system which suitstheir needs and benefits their business.
The AVX ‘one stop shopping’ concept is already beneficial in meeting the needs of major OEMs while worldwide partnerships with only the premier division of distributors aidsthe smaller user.
Helping to market the breadth and depth of our electroniccomponent line card and support our customers are a dedicated team of commercial sales people, applicationsengineers and product marketing managers. Their qualifica-tions are hopefully always appropriate to your commercialneed, but as higher levels of technical expertise are required,access directly to the appropriate department is seamlessand transparent.
Total quality starts and finishes with our customer service,and where cost and quality are perceived as given quantitiesthe AVX service invariably has us selected as the preferredsupplier.
Facilities are equipped with instant worldwide computer andtelecommunication links connected to every sales and pro-duction site worldwide. That ensures that our customersdelivery requirements are consistently met wherever in theworld they may be.
2
Introduction
AVX Tantalum
APPLICATIONS
2-16 VoltLow ESRLow Profile Case0603 availableLow Failure RateHigh Volumetric EfficiencyTemperature StabilityStable over Time50 Volt @ 85°C33 Volt @ 125°CAutomotive range duesecond half 1998High ReliabilityTemperature StabilityQS9000 approved2-35 VoltLow ESRLow Profile Case0603 availableLow Failure RateHigh Volumetric EfficiencyTemperature StabilityStable over TimeQUALITY STATEMENTS
AVX’s focus is CUSTOMER satisfaction - customer satisfac-tion in the broadest sense: product quality, technical support,product availability and all at a competitive price.
In pursuance of the ethos and established goals of our corporate wide QV2000 program, it is the stated objective of AVX Tantalum to supply our customers with a world classservice in the manufacturing and supplying of electroniccomponents which will result in an adequate return oninvestment.
This world class service shall be defined as consistently supplying product and services of the highest quality andreliability.
This should encompass, but not be restricted to all aspectsof the customer supply chain.
In addition any new or changed products, processes or services will be qualified to established standards of qualityand reliability.
The objectives and guidelines listed above shall be achievedby the following codes of practice:
1.Continual objective evaluation of customer needs andexpectations for the future and the leverage of all AVXresources to meet this challenge.
2.By continually fostering and promoting culture of continu-ous improvement through ongoing training and empoweredparticipation of employees at all levels of the company.
3.By Continuous Process Improvement using sound engi-neering principles to enhance existing equipment, materialand processes. This will involve the application of the science of S.P.C. focused on improving the ProcessCapability Index, Cpk.
All AVX Tantalum manufacturing locations are ISO9000approved and Paignton is approved to QS9000 - AutomotiveQuality System Requirements.
3
TAJSeries
The TAJ standard series encompassesthe five key sizes recognized by majorOEMs throughout the world. The V casesize has been added to the TAJ range to allow high CVs to be offered. Theoperational temperature is -55°C to
+85°C at rated voltage and up to +125°Cwith voltage derating in applications utilizing recommended series resistance. TAJ is available in standard and extendedranges.
CASE DIMENSIONS:millimeters (inches)
CodeABCDEV
EIACode32163528603273437343H
W+0.2 (0.008)-0.1 (0.004)1.6 (0.063)2.8 (0.110)3.2 (0.126)4.3 (0.169)4.3 (0.169)6.1 (0.240)
L±0.2 (0.008)3.2 (0.126)3.5 (0.138)6.0 (0.236)7.3 (0.287)7.3 (0.287)7.3 (0.287)
H+0.2 (0.008)-0.1 (0.004)1.6 (0.063)1.9 (0.075)2.6 (0.102)2.9 (0.114)4.1 (0.162)3.45±0.3(0.136±0.012)
W1±0.2 (0.008)1.2 (0.047)2.2 (0.087)2.2 (0.087)2.4 (0.094)2.4 (0.094)3.1 (0.120)
A+0.3 (0.012)-0.2 (0.008)0.8 (0.031)0.8 (0.031)1.3 (0.051)1.3 (0.051)1.3 (0.051)1.4 (0.055)
S Min.1.1 (0.043)1.4 (0.055)2.9 (0.114) 4.4 (0.173) 4.4 (0.173) 3.4 (0.133)
W1dimension applies to the termination width for A dimensional area only.
HOW TO ORDER
TAJ
Type
C
Case CodeSee table above
106
Capacitance CodepF code: 1st twodigits represent significant figures3rd digit representsmultiplier (number ofzeros to follow)
M
ToleranceK=±10%M=±20%
025
Rated DC Voltage
R
PackagingConsult page 42for details
**
Additional
characters may beadded for specialrequirements
TECHNICAL SPECIFICATIONS
Technical Data:
Capacitance Range:Capacitance Tolerance:Rated Voltage (VR)Category Voltage (VC)Surge Voltage (VS)Surge Voltage (VS)Temperature Range:
Environmental Classification:Reliability Qualification
All technical data relate to an ambient temperature of +25°C0.1µF to 470µF±20%; ±10%
+85°C:246.3101620253550+125°C:1.32.7 4 71013172333+85°C: 2.75.28132026324665+125°C:1.73.2581216202840
-55°C to +125°C55/125/56 (IEC 68-2)
1% per 1000h at 85°C with a 0.1Ω/V series impedance, 60% confidence levelCECC 30801 - 005 issue 1EIA 535BAAC
ϹϹϹϹ
4
TAJSeries
CAPACITANCE AND VOLTAGE RANGE(LETTER DENOTES CASE CODE)
CapacitanceµFCode0.101040.151540.222240.333340.474740.686841.01051.51552.22253.33354.74756.8685101061515622226333374766868610010715015722022733033747047768068710001081500158
= Standard Range= Extended Range= Development Range
2V4V6.3V
Rated voltage (VR) at 85°C
10V16V20V
25V
A
AAB AAA/B
A BA
B/CB/C
BB
C/D
CEDE
DE
AAAA/BA/BB AB/C AC BAC/D BC/D BD CBC/DC/DEE/ V DE
A
AA
AAAAA/BA/BAA/BA/BA/BB AB/C AA/BB/C AB/CB/C AB/C AC BB/C A C BC/D B C BA C/D BD CB
C/D BD CBD CD CBD C DC D CD CE DD CE DVD/EE DD/VEE DVD/ED/E/ VEEVV
AAAA/BB AB/CC BC BC/DDD CE DDE
35VAAAAA/BA/BB AB/C AB/CC BC/D BD CD CDCE DDE 50V
AA/BA/BBCCCD CDDDDE
5
TAJ Series
RATINGS & PART NUMBER REFERENCE
AVXPart No.CaseSizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHzAVXPart No.CaseSizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHz2 volt @ 85°C (1.2 volt @ 125°C)TAJA476*002A470.963.010 volt @ 85°C (6.3 volt @ 125°C)TAJA155*010TAJA225*010TAJA335*010TAJA475*010TAJB475*010TAJA685*010TAJB685*010TAJA106*010TAJB106*010TAJC106*010TAJA156*010TAJB156*010TAJC156*010TAJB226*010TAJC226*010TAJB336*010TAJC336*010TAJD336*010TAJC476*010TAJD476*010TAJC686*010TAJD686*010TAJC107*010TAJD107*010TAJD157*010TAJE157*010TAJD227*010TAJE227*010TAJD337*010TAJE337*010TAJV337*010TAJE477*010AAAABABABCABCBCBCDCDCDCDDEDEDEVE1.52.23.34.74.76.86.81010101515152222333333474768681001001501502202203303303304700.50.50.50.50.50.70.71.01.01.01.51.51.52.22.23.33.33.34.74.76.86.810.010.015.015.022.022.033.033.033.047.066666666666666666666666688888881010.07.05.55.04.04.03.03.02.52.53.22.82.02.41.82.01.61.11.20.91.30.91.20.90.90.90.90.90.90.90.90.94 volt @ 85°C (2.5 volt @ 125°C)TAJA475*004TAJA685*004TAJA106*004TAJA156*004TAJB156*004TAJA226*004TAJA336*004TAJB336*004TAJB476*004TAJB686*004TAJC686*004TAJB107*004TAJC107*004TAJC227*004TAJD227*004TAJE337*004AAAABAABBBCBCCDE4.76.81015152233334768681001002202203300.50.50.50.60.60.91.31.41.92.72.74.04.08.88.813.266666666666868887.56.56.04.03.03.53.02.82.41.81.61.61.31.20.90.96.3 volt @ 85°C (4 volt @ 125°C)TAJA225*006TAJA335*006TAJA475*006TAJA685*006TAJB685*006TAJA106*006TAJB106*006TAJA156*006TAJB156*006TAJA226*006TAJB226*006TAJC226*006TAJB336*006TAJC336*006TAJB476*006TAJC476*006TAJD476*006TAJB686*006TAJC686*006TAJD686*006TAJC107*006TAJD107*006TAJC157*006TAJD157*006TAJC227*006TAJD227*006TAJE337*006TAJE477*006TAJV477*006AAAABABABABCBCBCDBCDCDCDCDEEV2.23.34.76.86.81010151522222233334747476868681001001501502202203304704700.50.50.50.50.50.60.61.01.01.41.41.42.12.13.03.03.04.34.34.36.36.39.59.513.913.920.829.629.6666666666666666668666666108810.07.06.05.04.04.03.03.52.53.02.52.02.21.82.01.61.11.81.60.91.40.91.30.91.20.90.90.90.916 volt @ 85°C (10 volt @ 125°C)TAJA105*016TAJA155*016TAJA225*016TAJB225*016TAJA335*016TAJB335*016TAJA475*016TAJB475*016TAJA685*016TAJB685*016TAJC685*016TAJB106*016TAJC106*016TAJB156*016TAJC156*016TAJB226*016TAJC226*016TAJD226*016TAJC336*016TAJD336*016TAJC476*016TAJD476*016TAJD686*016TAJD107*016TAJE107*016TAJD157*016TAJV157*016TAJV227*016AAABABABABCBCBCBCDCDCDDDEDVV1.01.52.22.23.33.34.74.76.86.86.81010151522222233334747681001001501502200.50.50.50.50.50.50.80.81.11.11.11.61.62.42.43.53.53.55.35.37.57.510.816.016.024.024.035.2466666666666666666666666668811.08.06.55.55.04.54.03.53.52.52.52.82.02.51.82.31.61.11.50.91.40.90.90.90.90.90.90.9All technical data relates to an ambient temperature of +25°C measured at 120 Hz, 0.5V RMS unless otherwise stated.*Insert K for ±10% and M for ±20%.NOTE: We reserve the right to supply higher specification parts in the samecase size, to the same reliability standards.For parametric information on development codes, please contact yourlocal AVX sales office.
6
TAJ Series
RATINGS & PART NUMBER REFERENCE
AVXPart No.CaseSizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHzAVXPart No.CaseSizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHz20 volt @ 85°C (13 volt @ 125°C)TAJA684*020TAJA105*020TAJA155*020TAJA225*020TAJB225*020TAJA335*020TAJB335*020TAJA475*020TAJB475*020TAJC475*020TAJB685*020TAJC685*020TAJB106*020TAJC106*020TAJB156*020TAJC156*020TAJD156*020TAJC226*020TAJD226*020TAJC336*020TAJD336*020TAJD476*020TAJD686*020TAJE686*020TAJV107*020AAAABABABCBCBCBCDCDCDDDEV0.681.01.52.22.23.33.34.74.74.76.86.81010151515222233334768681000.50.50.50.50.50.70.71.01.01.01.41.42.02.03.03.03.04.44.46.66.69.413.613.620.0446666666666666666666666812.09.06.55.33.54.53.04.03.02.82.52.02.11.92.02.01.11.60.91.50.90.90.90.90.935 volt @ 85°C (23 volt @ 125°C)TAJA104*035TAJA154*035TAJA224*035TAJA334*035TAJA474*035TAJB474*035TAJA684*035TAJB684*035TAJA105*035TAJB105*035TAJA155*035TAJB155*035TAJC155*035TAJB225*035TAJC225*035TAJB335*035TAJC335*035TAJB475*035TAJC475*035TAJD475*035TAJC685*035TAJD685*035TAJC106*035TAJD106*035TAJC156*035TAJD156*035TAJD226*035TAJE226*035TAJD336*035AAAAABABABABCBCBCBCDCDCDCDDED0.10.150.220.330.470.470.680.681.01.01.51.51.52.22.23.33.34.74.74.76.86.810.010.015.015.022.022.033.00.50.50.50.50.50.50.50.50.50.50.50.50.50.80.81.21.21.61.61.62.42.43.53.55.35.37.77.711.444444444666666666666666666624.021.018.015.012.010.08.08.07.56.57.55.24.54.23.53.52.53.12.21.51.81.31.61.01.40.90.90.90.925 volt @ 85°C (16 volt @ 125°C)TAJA474*025TAJA684*025TAJA105*025TAJA155*025TAJB155*025TAJA225*025TAJB225*025TAJB335*025TAJC335*025TAJB475*025TAJC475*025TAJB685*025TAJC685*025TAJC106*025TAJD106*025TAJD156*025TAJC226*025TAJD226*025TAJD336*025TAJE336*025TAJD476*025AAAABABBCBCBCCDDCDDED0.470.681.01.51.52.22.23.33.34.74.76.86.810101522223333470.50.50.50.50.50.60.60.80.81.21.21.71.72.52.53.85.55.58.38.311.844466666666666666666614.010.08.07.55.07.04.53.52.82.82.42.82.01.81.21.01.40.90.90.90.950 volt @ 85°C (33 volt @ 125°C)TAJA104*050TAJA154*050TAJB154*050TAJA224*050TAJB224*050TAJB334*050TAJC474*050TAJC684*050TAJC105*050TAJC155*050TAJD155*050TAJD225*050TAJD335*050TAJD475*050TAJD685*050TAJE106*050AABABBCCCCDDDDDE0.10.150.150.220.220.330.470.681.01.51.52.23.34.76.810.00.50.50.50.50.50.50.50.50.50.80.81.11.72.43.45.0444444444666666822.015.017.018.014.012.08.07.05.54.54.02.52.01.41.00.9All technical data relates to an ambient temperature of +25°C measured at 120 Hz, 0.5V RMS unless otherwise stated.*Insert K for ±10% and M for ±20%.
NOTE: We reserve the right to supply higher specification parts in the
same case size, to the same reliability standards.
For parametric information on development codes, please contact yourlocal AVX sales office.7
TAJSeries
Low Profile
Three additional case sizes are availablein the TAJ range offering low profile solidtantalum chip capacitors. Designed forapplications where maximum height ofcomponents above or below board are of
prime consideration, this height of 1.2mmequates to that of a standard integrated circuit package after mounting. The S&Tfootprints are identical to the A&B casesize parts.
CASE DIMENSIONS:millimeters (inches)
CodeR*S**T**WY
EIACode20123216L3528L——
W+0.2 (0.008)-0.1 (0.004)1.3 (0.051)1.6 (0.063)2.8 (0.110)3.2 (0.126)4.3 (0.169)
L±0.2 (0.008)2.05 (0.081)3.2 (0.126)3.5 (0.138)6.0 (0.236)7.3 (0.287)
H Max.1.2 (0.047)1.2 (0.047)1.2 (0.047)1.5 (0.059)2.0 (0.079)
W1±0.1 (0.004)1.2 (0.047)1.2 (0.047)2.2 (0.087)2.2 (0.087)2.4 (0.094)
A+0.3 (0.012)-0.1 (0.004)0.5 (0.020)0.8 (0.031)0.8 (0.031)1.3 (0.051)1.3 (0.051)
S Min.0.85 (0.033) 1.1 (0.043) 1.4 (0.055)2.9 (0.114)4.4 (0.173)
* 0805 Equivalent
** Low Profile Versions of A & B Case
W1dimension applies to the termination width for A dimensional area only.Pad Stand-off is 0.1±0.1.
CAPACITANCE AND VOLTAGE RANGE (LETTER DENOTES CASE CODE)
CapacitanceµFCode0.101040.151540.222240.333340.474740.686841.01051.51552.22253.33354.74756.868510106151562222633337476686861001071501572202273303374704776806871000108= Standard Range= Development Range
X= 1.5mm height in a D case footprint
2V4VRated voltage (VR) at 85°C6.3V10V16VRRSR/SR/SR/SS/TR/TR/SR/SR/SS/TTRTWWXYR/SR/SR/SS/TT RTTR/SR/S/TSTTW20VR/SR/SR/SR/SR/SR/S/TR/S/TTT25VWWWXYWWXX/YYWXYY WYXYXYXY8
TAJ Series
Low Profile
RATINGS & PART NUMBER REFERENCE
AVXPart No.CaseSizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHzAVXPart No.CaseSizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHz2 voltTAJR475*002TAJR685*002TAJS106*002RRS4.76.810.00.50.50.566620.020.020.0TAJR684*016TAJS684*016TAJR105*016TAJS105*016TAJT105*016TAJS155*016TAJT225*016TAJT335*016TAJW106*016RSRSTSTTW16 volt0.680.681.01.01.01.52.23.310.00.50.50.50.50.50.50.50.51.4444666625.025.020.015.015.012.06.55.02.04 volt TAJR225*004TAJS225*004TAJR335*004TAJS335*004TAJR475*004TAJS475*004TAJS685*004TAJT685*004TAJR106*004TAJT106*004TAJR155*006TAJS155*006TAJR225*006TAJS225*006TAJR335*006TAJS335*006TAJS475*006TAJT475*006TAJT685*006TAJT156*006TAJW336*006RSRSRSSTRTRSRSRSSTTTW2.22.23.33.34.74.76.86.810.010.00.50.50.50.50.50.50.50.50.50.50.50.50.50.50.50.50.50.50.51.02.166666666666666666666625.025.020.018.012.010.08.06.010.05.025.025.020.018.012.09.07.56.05.04.52.020 voltTAJR104*020TAJS104*020TAJR154*020TAJS154*020TAJR224*020TAJS224*020TAJR334*020TAJS334*020TAJR474*020TAJS474*020TAJR684*020TAJS684*020TAJT684*020TAJR105*020TAJS105*020TAJT105*020TAJT155*020TAJT225*020RSRSRSRSRSRSTRSTTT0.10.10.150.150.220.220.330.330.470.470.680.680.681.01.01.01.52.20.50.50.50.50.50.50.50.50.50.50.50.50.50.50.50.50.50.544444444444444446625.025.025.025.025.025.025.025.025.025.025.025.015.020.012.09.06.56.06.3 volt1.51.52.22.23.33.34.74.76.815.033.010 voltTAJR105*010TAJS105*010TAJR155*010TAJS155*010TAJR225*010TAJS225*010TAJS335*010TAJT335*010TAJT475*010TAJT685*010TAJT106*010TAJY686*010TAJY107*010RSRSRSSTTTTYY1.01.01.51.52.22.23.33.34.76.810.0681000.50.50.50.50.50.50.50.50.51.01.06.810446666666666625.025.020.020.015.012.08.06.05.04.03.00.90.9For parametric information on development codes, please contact yourlocal AVX sales office.All technical data relates to an ambient temperature of +25°C measured at120 Hz, 0.5V RMS unless otherwise stated.*Insert K for ±10% and M for ±20%.
NOTE: We reserve the right to supply higher specification parts in the
same case size, to the same reliability standards.
9
TPS Series
Low ESR
The TPS surface mount products have inherently low ESR (equivalent seriesresistance) and are capable of higher ripple current handling, producing lowerripple voltages, less power and heat dissipation than standard product for themost efficient use of circuit power. TPShas been designed, manufactured, and
preconditioned for optimum performancein typical power supply applications. Bycombining the latest improvements intantalum powder technology, improvedmanufacturing processes, and applica-tion specific preconditioning tests, AVX isable to provide a technologically superioralternative to the standard range.
CASE DIMENSIONS:millimeters (inches)
CodeABCDEVEIACode32163528603273437343HW+0.2 (0.008)-0.1 (0.004)1.6 (0.063)2.8 (0.110)3.2 (0.126)4.3 (0.169)4.3 (0.169)6.1 (0.240)L±0.2 (0.008)3.2 (0.126)3.5 (0.138)6.0 (0.236)7.3 (0.287)7.3 (0.287)7.3 (0.287)H+0.2 (0.008)-0.1 (0.004)1.6 (0.063)1.9 (0.075)2.6 (0.102)2.9 (0.114)4.1 (0.162)3.45 ±0.3(0.136±0.012)W1±0.2 (0.008)1.2 (0.047)2.2 (0.087)2.2 (0.087)2.4 (0.094)2.4 (0.094)3.1 (0.120)A+0.3 (0.012)-0.2 (0.008)0.8 (0.031)0.8 (0.031)1.3 (0.051)1.3 (0.051)1.3 (0.051)1.4 (0.055)S Min.1.1 (0.043)1.4 (0.055)2.9 (0.114) 4.4 (0.173) 4.4 (0.173) 3.4 (0.133)W1dimension applies to the termination width for A dimensional area only.HOW TO ORDERTPSTypeDCase SizeSee table above107Capacitor CodepF code: 1st twodigits represent significant figures,3rd digit representsmultiplier (number ofzeros to follow)MToleranceK=±10%M=±20%010RatedDC VoltageRPackaging Consult page 42for details0100Maximum ESR inMilliohms*See note belowNOTE: The EIA & CECC standards for low ESR Solid Tantalum Capacitors allow an ESR movement to 1.25 times catalog limit post mountingTECHNICAL SPECIFICATIONSTechnical Data:Capacitance Range:Capacitance Tolerance:Rated Voltage (VR)Category Voltage (VC)Surge Voltage (VS)Surge Voltage (VS)Temperature Range:Environmental Classification:Reliability:
All technical data relate to an ambient temperature of +25°C1.5µF to 470µF±20%; ±10% Ϲ+85°C:6.31016202535Ϲ +125°C:4710131723Ϲ +85°C: 81320263246Ϲ +125°C:5812162028-55°C to +125°C55/125/56 (IEC 68-2)
1% per 1000h at 85°C with 0.1Ω/V series impedance, 60% confidence level
10
TPS Series
Low ESR
CAPACITANCE AND VOLTAGE RANGE (LETTER DENOTES CASE CODE)
CapacitanceµF Code1.53.34.76.8101522155335475685106156226A(1500)A(1800)A(1000)B(700)B(800)C(375)B(1000)C(450)D(200)C(500)D(300)E(200)C(450)D(300)D(400)E(200-300)D(300)A(3500)A(1800)B(1500)C(600)6.3V10VRated voltage (VR) at 85°C16V20V25VA(3000)35V3347681001502203304703376686107157227337477B(600)C(375-500)C(350)C(300)C(350)D(150-200)D(150)D(200)E(150)E(125-150)V(85-200)E(175-300)D(250)V(95-300)C(150)D(125)D(100)E(100-150)V(60-100)E(50-200)V(55-100)C(200)D(65-140)E(125)D(100)D (150)E(60-150)V(60)D(150)E(60-100)V(60-100)E(50-200)D(125-150)E(100-150)D(150)V(75)V(75-150)ESR limits quoted in brackets are in milliohms11
TPS Series
Low ESR
RATINGS & PART NUMBER REFERENCE
AVXPart No.TPSA156*006R1500TPSB336*006R0600TPSC107*006R0150TPSD157*006R0125TPSD227*006R0100TPSE337*006R0100TPSE337*006R0125TPSE337*006R0150TPSV337*006R0060TPSV337*006R0100TPSE477*006R0050TPSE477*006R0100TPSE477*006R0200TPSV477*006R0055TPSV477*006R0100TPSA106*010R1800TPSA156*010R1000TPSB226*010R0700TPSC336*010R0375TPSC336*010R0500TPSC476*010R0350TPSC107*010R0200TPSD107*010R0065TPSD107*010R0080TPSD107*010R0100TPSD107*010R0125TPSD107*010R0140TPSD107*010R0150TPSE107*010R0125TPSD157*010R0100TPSD227*010R0150TPSE227*010R0060TPSE227*010R0100TPSE227*010R0125TPSE227*010R0150TPSV227*010R0060TPSD337*010R0150TPSE337*010R0060TPSE337*010R0100TPSV337*010R0060TPSV337*010R0100TPSE477*010R0050TPSE477*010R0100TPSE477*010R0200CaseSizeABCDDEEEVVEEEVVAABCCCCDDDDDDEDDEEEEVDEEVVEEECapacitanceµF1533100150220330330330330330470470470470470101522333347100100100100100100100100150220220220220220220330330330330330470470470RatedVoltageDCLDF(µA)%Max.Max.6.3 0.966.3 2.166.3 6.366.39.566.3 13.9 66.320.886.320.886.320.886.3 20.8 86.320.886.329.6106.329.6106.3 29.6 106.3 29.6106.329.610101.06101.56102.26103.36103.36104.761010.081010.0 610 10.061010.061010.061010.061010.061010.061015.061022.0 81022.0 81022.0 81022.0 81022.0 81022.081033.0 81033.0 81033.0 81033.081033.0 101047.0 101047.0 101047.0 10ESRMax. (mΩ)@100kHz15006001501251001001251506010050100200551001800100070037550035020065801001251401501251001506010012515060150601006010050100200100kHz Ripple Current (mA) Ratings25ºC2243768561095122512851149104920411581181712859082132158120427434854246956174215191369122510951035100011491225100016581285114910492041100016581285204115811817128590885ºC2003377669801095114910238182614141625114981219071414183245312484420501663135912251095980921028109541483114910238182148311491826141416251149812125ºC1513434384905144604208166327275143638536328211013921718822429760854749043841440046049040066351446042081740066351481763272751436312
TPS Series
Low ESR
RATINGS & PART NUMBER REFERENCE
AVXPart No.TPSA335*016R3500TPSB156*016R0800TPSC226*016R0375TPSC336*016R0300TPSC476*016R0350TPSD476*016R0150TPSD476*016R0200TPSD686*016R0150TPSD107*016R0125TPSD107*016R0150TPSE107*016R0100TPSE107*016R0125TPSE107*016R0150TPSD157*016R0150TPSV157*016R0075TPSE227*016R0100TPSV227*016R0075TPSV227*016R0150TPSA475*020R1800TPSB106*020R1000TPSC156*020R0450TPSD336*020R0200TPSE476*020R0150TPSE686*020R0125TPSE686*020R0150TPSV107*020R0085TPSV107*020R0200TPSA155*025R3000TPSB475*025R1500TPSC106*025R0500TPSD226*025R0200TPSE336*025R0175TPSE336*025R0200TPSE336*025R0300TPSD476*025R0250TPSV686*025R0095TPSV686*025R0150TPSV686*025R0300TPSC475*035R0600TPSD106*035R0300TPSE106*035R0200TPSC156*035R0450TPSD156*035R0300TPSD226*035R0400TPSE226*035R0200TPSE226*035R0300TPSD336*035R0300CaseSizeABCCCDDDDDEEEDVEVVABCDEEEVVABCDEEEDVVVCDECDDEEDCapacitanceµF3.3152233474747681001001001001001501502202202204.71015334768681001001.54.71022333333476868684.71010151522222233RatedVoltage1616161616161616161616161616161616162020202020202020202525252525252525252525353535353535353535DCL(µA)Max.0.52.43.55.37.57.57.510.916.016.016.016.016.024.024.035.235.235.20.92.03.06.69.413.613.620.020.00.51.22.55.58.38.38.311.817.017.017.01.63.53.55.35.37.77.77.711.6DF%Max.666666666666688881066666668106666666681010666666666ESRMax. (mΩ)@100kHz3500800375300350150200150125150100125150150751007515018001000450200150125150852003000150050020017520030025095150300600300200450300400200300300100kHz Ripple Current (mA) Ratings25ºC146326542606561100086610001095100012851149104910001826128518261291204292494866104911491049171511181582384698669719087427751622129191342870790849470761290874270785ºC13129248454250147754980411491023841633114916331155183261442775938102381534100014121342077586881266369314511155816383632812442632548812663632125ºC59130217242224400340043840051446042040073051473051682117198342016042068476395188346388363297310951636517128336319828324536329728313
TACmicrochipLWHSTANDARD CAPACITANCE RANGE(LETTER DENOTES CASE CODE) CapacitanceµFCode0.474740.686841.01051.51552.22253.3335 4.74756.868510.010615.015622.022633.0337.0476= Standard Range= Extended Range= Development Range14Rated voltage at 85°C3VLLLLRRRRLLLLRRRRRRRR2V4V6.3V10VLLLLLRRRLLLLLLLTACmicrochip
RATINGS AND PART NUMBER REFERENCE
AVXStyleCaseSizeCapacitanceµF@120HzLeakageµA(Max)DF%MaxESRMax@100kHzAVXStyleCaseSizeCapacitanceµF@120HzLeakageµA(Max)DF%MaxESRMax@100kHz(2 volt)TACTACTACTACTACTACTACTACTACTACTACTACTACTACTAC0805080508050805080508050805080508050805080508050805080508052233470.50.71.0888888888888888666666666666666TACTACTACTACTACTACTACTACTACTACTACTACTACTACTACTAC06030603060306030603060306030603060306030603060306030603060306033.34.76.8(2 volt)0.50.50.5666666666666666610101010101010101010101012101010(3 volt)1522330.50.71.02.23.34.7(3 volt)0.50.50.5(4 volt)1015220.50.60.91.52.23.3(4 volt)0.50.50.5(6.3 volt)6.810150.50.60.91.01.52.2(6.3 volt)0.50.50.5(10 volt)4.76.8100.50.71.00.470.681.01.5(10 volt)0.50.50.50.5HOW TO ORDER
TAC
TypeTACmicrochip
L
Case Code
225
Capacitance CodepF code: 1st twodigits represent significant figures,3rd digit representsmultiplier (number ofzeros to follow)
M
Tolerance K=±10%M=±20%
003
Rated DC Voltage
R**
PackagingAdditionalX=8mm 4-1/4\"characters may beTape & Reeladd for special
requirementsR=7\" Tape & Reel
Solder Plated
15
TACmicrochip
Average ESR (Ohms)35302520151050DTACmicrochip TechnologyConventional TechnologyValueAddedCABCase Size08050603Figure 1.98TACmicrochip average7Molded average6Value5Added4321087809192939495969798Continued investment in R&D has resulted in AVX introducing revolutionary technology to the tantalumcapacitor market.The new TACmicrochip breaks new ground with theunique structure allowing 10 times more capacitance tobe packaged in the 0603 case size than is possible withtraditional technology.Conventional molded tantalum technology results in an increase in ESR for each reduction in case size.Figure 1 shows a reduction in ESR performance of theTACmicrochip compared to the same case size if con-ventional technology were used.Figure 2 shows a major leap forward in µF/mm3performance. The CV values offered in the 0603 cannotbe achieved using conventional molded technology.These features coupled with the temperature and voltage stability of tantalum, enable system designers toachieve equipment miniaturization without compromis-ing performance, making TACmicrochip the optimumchoice for size critical applications.µF (mm3)Figure 2.7060DCL (nA)50403020100010ESR (Ohms)TACL155M006 DCL vs VoltageEnhancing Leakage Current & BatteryEfficiency.As portable electronic equipment becomes an integralpart of everyday life, a key design focus becomes the ability to enhance and extend battery efficiency per-formance. Overall leakage current capability improve-ments are achieved using the unique TACmicrochipconstruction technology.1234Voltage (V)56TACL155M004ESR with FrequencyEnhanced ESR& High Frequency Operation.The radically new construction technique used to manufacture the TACmicrochip eliminates a great manyof the parasitic inductance resistance paths inherent in standard molded tantalum capacitors, giving theTACmicrochip an equivalent high frequency perfor-mance of larger sized product.10.11E+021E+031E+041E+051E+061E+071E+08Frequency (Hz)1.58TACL155M0061.56Cap. with Temperature1.541.521.501.481.461.441.421.40-60-40-20020406080100120140Temperature (°C)Capacitance (µF)Volumetric Efficiency, Space & Weight Savings.Achieving the industries highest available capacitance in 0603 case size allows high bulk energy storage with minimal use of valuable circuit board space. Addstable temperature and voltage performance andTACmicrochip becomes your preferred choice of minia-ture tantalum chip capacitor for size critical applications.16
TACmicrochip
SURFACE MOUNTING CHIP SOLDERING
WIRE BONDING WITHIN THE
SEMICONDUCTOR CHIP PACKAGE
QUADSARRAYS
OTHER POSSIBLE CONFIGURATIONS FOR THE WAFER CAPACITOR
The manufacturing techniques used to make theTACmicrochip allow AVX to offer various custom options.Some examples of which are shown above. Please contactyour local AVX sales office if you have a specific requirement.
17
TAZ Series
The TAZ molded surface mount series isdesigned for use in applications utilizingeither solder, conductive adhesive or ther-mal compression bonding techniques.Case sizes (A through H) are compatiblewith CWR06 pad layouts and are qualifiedas the CWR09 style.
The two styles are interchangeable perMIL-C-55365/4. Each chip is marked
with polarity, capacitance code and ratedvoltage. There are three termination finishes available: fused solder plated(standard) (“K” per MIL-C-55365), hotsolder dipped (“C”) and gold plated (“B”).In addition, the molding compound hasbeen selected to meet the flammabilityrequirements of UL94V-O and outgassingrequirements of NASA SP-R-0022A.
CASE DIMENSIONS:millimeters (inches)
CaseCode WidthLengthHeightW±0.38 (0.015)L±0.38 (0.015)H±0.38 (0.015)Term. WidthW11.27±0.13(0.050±0.005)1.27±0.13(0.050±0.005)
Term. LengthA+0.13 (0.005)“S” Min“Regular”ABDEFG
NOTE: For solder coated terminations add
0.38 (0.015) max. to length andheight dimensions.
H
1.27 (0.050)1.27 (0.050)2.54 (0.100)2.54 (0.100)3.43 (0.135)2.79 (0.110)3.81 (0.150)
2.54 (0.100)3.81 (0.150)3.81 (0.150)5.08 (0.200)5.59 (0.220)6.73 (0.265)7.24 (0.285)
1.27 (0.050)1.27 (0.050)1.27 (0.050)1.27 (0.050)1.78 (0.070)2.79 (0.110)2.79 (0.110)
0.76 (0.030)0.76 (0.030)
0.38 (0.015)1.65 (0.065)1.65 (0.065)2.92 (0.115)3.43 (0.135)3.56 (0.140)4.06 (0.160)
2.41+0.13/-0.250.76 (0.030)(0.095+0.005/-0.010)2.41+0.13/-0.250.76 (0.030)(0.095+0.005/-0.010)3.30±0.13(0.130±0.005)2.67±0.13(0.105±0.005)
0.76 (0.030)1.27 (0.050)
3.68+0.13/-0.511.27 (0.050)(0.145+0.005/-0.020)Additional special case sizes are available. Contact your local sales office for details.
TECHNICAL SPECIFICATIONS
Technical Data
Capacitance RangeCapacitance ToleranceRated Voltage (VR)Category Voltage (VC)Surge Voltage (VS)Surge Voltage (VS)
Operating Temperature RangeReliabilityQualification
All technical data relate to an ambient temperature of +25°C0.1µF to 220µF±20%; ±10%
+85°C:46.3101520253550+125°C:2.7471013172333+85°C: 5.28132026334665+125°C:3.2581216202840
-55°C to +125°C
1% per 1000h at 85°C with a 0.1Ω/V series impedance, 60% confidence level MIL-C-55365/4
ϹϹϹϹ
18
TAZ Series
HOW TO ORDER
TAZ
D
Case CodeSee table onpage 18
335
Capacitance
CodepF code: 1st two digitsrepresent significant figures, 3rddigit representsmultiplier(number ofzeros to follow)
M
ToleranceJ=±5% K=±10%M=±20%
015
Rated DCVoltage
C
Lead
ConfigurationC = ChipX = Extended
Range
R
PackagingConsultpage 44for details
SZ*0000*
(Professional Grade)Type
*Not applicable to European orders (other endings are
ManufacturingTerminationRouting andFinish*Failure Rate*0000 = FusedS = StandardSolderZ = NotPlated
applicable0800 = Hot
SolderDipped
0900 = Gold
Plated
assigned by the factory for special customer requirements)
MARKING
The positive end of body has videcon readable polarity barmarking along with the capacitance code and rated workvoltage:
• Polarity Stripe (+)• Capacitance Code• Voltage RatingThe electrical and mechanical parameters shown on theTAZ series are general.
For specific circuit applications, special screening is available. Please contact AVX if you have special electrical or mechanical requirements.
TYPICAL LEAD FRAME MATERIALTHICKNESSES
Lead Frame: Alloy 194
Thickness: 0.005±0.0002\"0000 - Fused Solder Plate: (60/40)
60-135 microinches nickel
300±75 microinches fused solder
0800 - Hot Solder Dipped: (60/40)
50-100 microinches nickelMin. 60 microinches solder
0900 - Gold Plated:
35-100 microinches nickel50-75 microinches gold
CAPACITANCE AND VOLTAGE RANGE (LETTER DENOTES CASE CODE)
CapacitanceµFCode0.11040.151540.222240.333340.474740.686841.01051.51552.22253.33354.74756.86851010615156222263333747668686100107150157220227
= Standard Range= Extended Range
4V6V10V
Rated voltage (VR) at 85°C
15V20V
25V35VA
AB ADB
EDFEGHFG
AB AD BEDFEGHFGH
ABAD BE DDFEEGHFGH
AABD BE DFEGFHH
ABABDBE DEF EGFHGH
ABBD
BDEFGHH
50VAABBDEFFGH
EDEFG FGHH
NOTE: TAZ Standard Range ratings are also available as CWR09 Military parts, see page 22.
19
TAZ Series
Standard Range
RATINGS & PART NUMBER REFERENCE (Standard Range and Special Case Sizes Only)
AVXPart No.CaseSizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHzAVXPart No.CaseSizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHz4 volt @ 85°C (2.5 volt @ 125°C)TAZA225(‡)004C*TAZB475(‡)004C*TAZD106(‡)004C*TAZE156(‡)004C*TAZF336(‡)004C*TAZG686(‡)004C*TAZH107(‡)004C*ABDERFH2.24.710.015.033.068.0100.01.01.01.01.02.03.04.066688101020.010.010.05.04.02.01.025 volt @ 85°C (16 volt @ 125°C)TAZA334(‡)025C*TAZB684(‡)025C*TAZD155(‡)025C*TAZE225(‡)025C*TAZF475(‡)025C*TAZG685(‡)025C*TAZG106(‡)025C*TAZH156(‡)025C*ABDEFGGH0.330.681.52.24.76.810.015.01.01.01.01.02.02.03.04.06666666625.015.010.08.06.04.03.02.06.3 volt @ 85°C (4 volt @ 125°C)TAZA155(‡)006C*TAZB335(‡)006C*TAZD685(‡)006C*TAZE106(‡)006C*TAZF226(‡)006C*TAZG476(‡)006C*TAZH686(‡)006C*ABDEFGH1.53.36.810.022.047.068.01.01.01.01.02.03.04.066668101012.012.012.06.04.02.02.035 volt @ 85°C (23 volt @ 125°C)TAZA224(‡)035C*TAZB474(‡)035C*TAZD105(‡)035C*TAZE155(‡)035C*TAZF335(‡)035C*TAZG475(‡)035C*TAZH685(‡)035C*ABDEFGH0.220.471.01.53.34.76.81.01.01.01.01.02.03.0666666625.020.012.06.06.03.03.010 volt @ 85°C (6.3 volt @ 125°C)TAZA105(‡)010C*TAZB225(‡)010C*TAZD475(‡)010C*TAZE685(‡)010C*TAZF156(‡)010C*TAZG336(‡)010C*TAZH476(‡)010C*ABDEFGH1.02.24.76.815.033.047.01.01.01.01.02.03.05.066666101018.012.010.04.03.03.02.050 volt @ 85°C (33 volt @ 125°C)TAZA104(‡)050C*TAZA154(‡)050C*TAZB224(‡)050C*TAZB334(‡)050C*TAZD684(‡)050C*TAZE105(‡)050C*TAZF155(‡)050C*TAZF225(‡)050C*TAZG335(‡)050C*TAZH475(‡)050C*AABBDEFFGH0.100.150.220.330.681.01.52.23.34.71.01.01.01.01.01.01.02.02.03.0666666666630.030.025.025.020.012.010.06.04.02.015 volt @ 85°C (10 volt @ 125°C)TAZA684(‡)015C*TAZB155(‡)015C*TAZD335(‡)015C*TAZE475(‡)015C*TAZF106(‡)015C*TAZG226(‡)015C*TAZH336(‡)015C*ABDEFGH0.681.53.34.710.022.033.01.01.01.01.02.04.05.0666668822.015.010.06.05.03.02.020 volt @ 85°C (13 volt @ 125°C)TAZA474(‡)020C*TAZB684(‡)020C*TAZB105(‡)020C*TAZD225(‡)020C*TAZE335(‡)020C*TAZF685(‡)020C*TAZG156(‡)020C*TAZH226(‡)020C*ABBDEFGH0.470.681.02.23.36.815.022.01.01.01.01.01.02.03.04.06666666620.015.015.010.08.05.03.02.0The electrical and mechanical parameters shown on the TAZ series aregeneral. For special circuit requirements, application specific testing isavailable. Please contact your local AVX sales office if you have specialelectrical or mechanical requirements.
DCL, DF and ESR limits are general information only. Contact AVX if yourapplication requires lower or tighter limits.
All technical data relates to an ambient temperature of +25°C. Capacitance andDF are measured at 120 Hz, 0.5V RMS with a maximum DC bias of 2.2 volts.DCL is measured at rated voltage after 5 minutes.‡ Insert J for ±5% tolerance, K for ±10%, M for ±20%
* Insert letter for packing option. See ordering information on page 19.
20
TAZ Series
Extended Range
RATINGS & PART NUMBER REFERENCE
AVXPart No.CaseSizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHzAVX CasePart No.SizeCapacitanceµFDCL(µA)Max.DF%Max.ESRmax. (Ω)@ 100 kHz4 voltTAZA475(‡)004X*TAZB106(‡)004X*TAZD226(‡)004X*TAZE336(‡)004X*TAZF107(‡)004X*TAZG157(‡)004X*ABDEFG4.710223310015011124666881010201010542TAZA105(‡)015X*TAZB335(‡)015X*TAZD475(‡)015X*TAZE106(‡)015X*TAZF226(‡)015X*TAZH686(‡)015X*ABDEFH15 volt13.34.710226811123106666682212106526 voltTAZA335(‡)006X*TAZB685(‡)006X*TAZD156(‡)006X*TAZE226(‡)006X*TAZF686(‡)006X*TAZG107(‡)006X*TAZH227(‡)006X*ABDEFGH3.36.8152268100220111246106666810101812104421TAZA684(‡)020X*TAZB225(‡)020X*TAZD335(‡)020X*TAZE475(‡)020X*TAZE685(‡)020X*TAZF156(‡)020X*TAZG226(‡)020X*TAZH476(‡)020X*ABDEEFGH20 volt0.682.23.34.76.8152247111123410666666882212108843210 voltTAZA225(‡)010X*TAZB475(‡)010X*TAZD685(‡)010X*TAZD106(‡)010X*TAZE156(‡)010X*TAZE226(‡)010X*TAZF476(‡)010X*TAZG686(‡)010X*TAZH107(‡)010X*ABDDEEFGH2.24.76.8101522476810011112346106666668101020128104432125 voltTAZB105(‡)025X*TAZD225(‡)025X*TAZE335(‡)025X*TAZF685(‡)025X*TAZH226(‡)025X*BDEFH12.23.36.8221112666668121086235 voltTAZH106(‡)035X*H10482‡ Insert J for ±5% tolerance, K for ±10%, M for ±20%
* Insert letter for packing option. See ordering information on page 19.
All technical data relates to an ambient temperature of +25°C. Capacitance andDF are measured at 120 Hz, 0.5V RMS with a maximum DC bias of 2.2 volts.DCL is measured at rated voltage after 5 minutes.
The electrical and mechanical parameters shown on the TAZ series aregeneral.
For special circuit requirements, application specific testing is available.Please contact your local AVX sales office if you have special electrical ormechanical requirements.
DCL, DF and ESR limits are general information only. Contact AVX if yourapplication requires lower or tighter limits.
NOTE: Voltage ratings are minimum values. We reserve the right to supply
higher voltage ratings in the same case size, to the same reliability standards.
21
CWR09 Series
MIL-C-55365/4
MARKING
Polarity Stripe (+)Capacitance Code
Rated Voltage
20V
HOW TO ORDER (MIL-C-55365/4)
CWR09
F
VoltageC=4D=6F=10H=15J=20K=25M=35N=50
B
TerminationFinishB=Gold PlatedC=Hot SolderDipped
K=Solder Fused
225
Capacitance
Code
K
ToleranceJ=±5%K=±10% M=±20%
MA\\TR
Packaging
Bulk (Standard if nothing is specified in this position)\\TR=7\"
Tape & Reel\\TR13=13\"Tape & Reel\\W=Waffle Pack
Type
Failure RateOptional Surge
CurrentExponential:
A=10 cycles atM=1%/1000
25°Chours
B=10 cycles at P=0.1%/1000
-55°C andhours
+85°CR=0.01%/1000
hours
S=0.001%/1000hoursWeibull: B=0.1%/1000hours
C=0.01%/1000hours
NOTES:CWR09 is fully interchangeable with CWR06.
Case Sizes correspond to TAZ A through H.
Packaging information can be found on page 44.
22
CWR09 Series
MIL-C-55365/4
ELECTRICAL RATINGS FOR CWR09 CAPACITORS
MIL-C-55365/4PartNumber(See Note)CaseSizeଙRatedVoltage(85°C)(volts)Capacitance(nom.)(µF)DC Leakage (max.)+25°C(µA)+85°C(µA)+125°C(µA)Dissipation Factor (max.)+25°C+85/125°C(%)(%)-55°C(%)Max. ESR100 kHz+25°CStyleCWR09(Ohms)8.08.05.54.03.52.21.10.98.08.05.54.53.52.21.10.910.08.05.54.53.52.51.10.912.08.05.55.04.02.51.10.914.010.012.06.05.04.02.41.10.9CWR09C*225†@᭝ᮀCWR09C*475†@᭝ᮀCWR09C*685†@᭝ᮀCWR09C*106†@᭝ᮀCWR09C*156†@᭝ᮀCWR09C*336†@᭝ᮀCWR09C*686†@᭝ᮀCWR09C*107†@᭝ᮀCWR09D*155†@᭝ᮀCWR09D*335†@᭝ᮀCWR09D*475†@᭝ᮀCWR09D*685†@᭝ᮀCWR09D*106†@᭝ᮀCWR09D*226†@᭝ᮀCWR09D*476†@᭝ᮀCWR09D*686†@᭝ᮀCWR09F*105†@᭝ᮀCWR09F*225†@᭝ᮀCWR09F*335†@᭝ᮀCWR09F*475†@᭝ᮀCWR09F*685†@᭝ᮀCWR09F*156†@᭝ᮀCWR09F*336†@᭝ᮀCWR09F*476†@᭝ᮀCWR09H*684†@᭝ᮀCWR09H*155†@᭝ᮀCWR09H*225†@᭝ᮀCWR09H*335†@᭝ᮀCWR09H*475†@᭝ᮀCWR09H*106†@᭝ᮀCWR09H*226†@᭝ᮀCWR09H*336†@᭝ᮀCWR09J*474†@᭝ᮀCWR09J*684†@᭝ᮀCWR09J*105†@᭝ᮀCWR09J*155†@᭝ᮀCWR09J*225†@᭝ᮀCWR09J*335†@᭝ᮀCWR09J*685†@᭝ᮀCWR09J*156†@᭝ᮀCWR09J*226†@᭝ᮀ* = Termination FinishB = Gold Plated
C = Hot Solder DippedK = Solder Fused
ABCDEFGHABCDEFGHABCDEFGHABCDEFGHABBCDEFGH444444446666666610101010101010101515151515151515202020202020202020† = Tolerance Code
J = ±5%K = ±10%M = ±20%
2.24.76.810.015.033.068.0100.01.53.34.76.810.022.047.068.01.02.23.34.76.815.033.047.00.681.52.23.34.710.022.033.00.470.681.01.52.23.36.815.022.01.01.01.01.01.02.03.04.01.01.01.01.01.02.03.04.01.01.01.01.01.02.03.05.01.01.01.01.01.02.04.05.01.01.01.01.01.01.02.03.04.010101010102030401010101010203040101010101020305010101010102040501010101010102030401212121212243812121212122438121212121224366012121212122448601212121212122438666888101066668810106666681010666666886666666668888101012128888101012128888881212888888888888888888881012121212888812121212888881012128888881010888888888ଙThe C case has limited availability. Wherepossible D case should be substituted.
@ = Failure Rate LevelExponential:
M = 1.0% per 1000 hoursP = 0.1% per 1000 hoursR = 0.01% per 1000 hoursS = 0.001% per 1000 hoursWeibull:
B = 0.1% per 1000 hoursC = 0.01% per 1000 hours
᭝= Optional Surge Current
A = 10 cycles at 25°CB = 10 cycles at -55°C
and +85°C
ᮀ= PackagingBulk Standard
\\TR=7\" Tape & Reel\\TR13=13\" Tape & Reel\\W=Waffle Pack
23
CWR09 Series
MIL-C-55365/4
ELECTRICAL RATINGS FOR CWR09 CAPACITORS
MIL-C-55365/4PartNumber(See Note)CaseSizeଙRatedCapacitanceVoltage(nom.)(85°C)(µF)(volts)DC Leakage (max.)+25°C(µA)+85°C(µA)+125°C(µA)Dissipation Factor (max.)+25°C+85/125°C(%)(%)-55°C(%)Max. ESR100 kHz+25°CStyleCWR09(Ohms)15.07.56.56.53.52.51.21.41.018.010.08.06.54.52.51.51.322.017.014.012.08.07.06.04.02.52.01.5CWR09K*334†@᭝ᮀCWR09K*684†@᭝ᮀCWR09K*105†@᭝ᮀCWR09K*155†@᭝ᮀCWR09K*225†@᭝ᮀCWR09K*475†@᭝ᮀCWR09K*685†@᭝ᮀCWR09K*106†@᭝ᮀCWR09K*156†@᭝ᮀCWR09M*224†@᭝ᮀCWR09M*474†@᭝ᮀCWR09M*684†@᭝ᮀCWR09M*105†@᭝ᮀCWR09M*155†@᭝ᮀCWR09M*335†@᭝ᮀCWR09M*475†@᭝ᮀCWR09M*685†@᭝ᮀCWR09N*104†@᭝ᮀCWR09N*154†@᭝ᮀCWR09N*224†@᭝ᮀCWR09N*334†@᭝ᮀCWR09N*474†@᭝ᮀCWR09N*684†@᭝ᮀCWR09N*105†@᭝ᮀCWR09N*155†@᭝ᮀCWR09N*225†@᭝ᮀCWR09N*335†@᭝ᮀCWR09N*475†@᭝ᮀABCDEFGGHABCDEFGHAABBCDEFFGH252525252525252525353535353535353550505050505050505050500.330.681.01.52.24.76.810.015.00.220.470.681.01.53.34.76.80.100.150.220.330.470.681.01.52.23.34.71.01.01.01.01.02.02.03.04.01.01.01.01.01.01.02.03.01.01.01.01.01.01.01.01.02.02.03.010101010102020304010101010101020301010101010101010202030121212121224243812121212121224361212121212121212242436666666666666666666666666666688888888888888888888888888888888888888888888888888888888NOTE:To complete the MIL-C-55365/4 Part Number, additional information
must be added:
* = Termination FinishB = Gold Plated
C = Hot Solder DippedK = Solder Fused
† = Tolerance Code
J = ±5%K = ±10%M = ±20%
Contact your local AVX sales office for latest qualification status.
ଙThe C case has limited availability. Wherepossible D case should be substituted.
@ = Failure Rate LevelExponential:
M = 1.0% per 1000 hoursP = 0.1% per 1000 hoursR = 0.01% per 1000 hoursS = 0.001% per 1000 hoursWeibull:
B = 0.1% per 1000 hoursC = 0.01% per 1000 hours
᭝= Optional Surge Current
A = 10 cycles at 25°CB = 10 cycles at -55°C
and +85°C
ᮀ= PackagingBulk Standard
\\TR=7\" Tape & Reel\\TR13=13\" Tape & Reel\\W=Waffle Pack
24
CWR11 Style
MIL-C-55365/8
MARKING
Polarity Stripe“J” for JAN Brand
Capacitance Code
Rated Voltage
(with manufacturer’s ID)
CASE DIMENSIONS:millimeters (inches)
CaseCodeABCDW1.6±0.2(0.063±0.008)2.8±0.2(0.110±0.008)3.2±0.3(0.126±0.012)4.3±0.3(0.169±0.012)L3.2±0.2(0.126±0.008)3.5±0.2(0.138±0.008)6.0±0.3(0.236±0.012)7.3±0.3(0.287±0.012)H1.6±0.2(0.063±0.008)1.9±0.2(0.075±0.008)2.5±0.3(0.098±0.012)2.8±0.3(0.110±0.012)W2±0.1 (±0.004)1.2(0.047)2.2(0.087)2.2(0.087)2.4(0.094)P±0.3 (±0.012)0.8(0.031)0.8(0.031)1.3(0.0.51)1.3(0.0.51)H2(min)0.7(0.028)0.7(0.028)1.0(0.039)1.0(0.039)HOW TO ORDER (MIL-C-55365/8)
CWR11
F
VoltageC=4D=6F=10H=15J=20K=25M=35N=50
A
TerminationFinishB=Gold PlatedC=Hot SolderDipped
K=Solder Fused
225
Capacitance
Code
K
ToleranceJ=±5%K=±10% M=±20%
MA\\TR
Packaging
Bulk (Standard if nothing is specified in this position)\\TR=7\"
Tape & Reel\\TR13=13\"Tape & Reel\\W=Waffle Pack
Type
Failure RateOptional Surge
CurrentExponential:
A=10 cycles atM=1%/1000
25°Chours
B=10 cycles at P=0.1%/1000
-55°C andhours
+85°CR=0.01%/1000
hours
S=0.001%/1000hoursWeibull:B=0.1%/1000hours
C=0.01%/1000hours
D=0.001%/1000hours
25
CWR11 Style
MIL-C-55365/8
ELECTRICAL RATINGS FOR CWR11 CAPACITORS
MIL-C-55365/8PartNumber(See Note)CWR11D*155†@᭝ᮀCWR11D*225†@᭝ᮀCWR11D*335†@᭝ᮀCWR11D*475†@᭝ᮀCWR11D*685†@᭝ᮀCWR11D*106†@᭝ᮀCWR11D*156†@᭝ᮀCWR11D*226†@᭝ᮀCWR11D*476†@᭝ᮀCWR11F*105†@᭝ᮀCWR11F*155†@᭝ᮀCWR11F*225†@᭝ᮀCWR11F*335†@᭝ᮀCWR11F*475†@᭝ᮀCWR11F*685†@᭝ᮀCWR11F*156†@᭝ᮀCWR11F*336†@᭝ᮀCWR11H*684†@᭝ᮀCWR11H*105†@᭝ᮀCWR11H*155†@᭝ᮀCWR11H*225†@᭝ᮀCWR11H*335†@᭝ᮀCWR11H*475†@᭝ᮀCWR11H*106†@᭝ᮀCWR11H*226†@᭝ᮀCWR11J*474†@᭝ᮀCWR11J*684†@᭝ᮀCWR11J*105†@᭝ᮀCWR11J*155†@᭝ᮀCWR11J*225†@᭝ᮀCWR11J*335†@᭝ᮀCWR11J*475†@᭝ᮀCWR11J*685†@᭝ᮀCWR11J*156†@᭝ᮀCaseSizeRatedVoltage(85°C)(volts)66666666610101010101010101515151515151515202020202020202020Capacitance(nom.)(µF)1.52.23.34.76.810.015.022.047.01.01.52.23.34.76.815.033.00.681.01.52.23.34.710.022.00.470.681.01.52.23.34.76.815.0DC Leakage (max.)+25°C(µA)0.50.50.50.50.50.60.91.42.80.50.50.50.50.50.71.53.30.50.50.50.50.50.71.63.30.50.50.50.50.50.71.01.43.0Dissipation Factor (max.)+25°C+85/125°C(%)(%)6666666666666666646666669699696966699996666998866698+85°C(µA)5.05.05.05.05.06.09.014.028.05.05.05.05.05.07.015.033.05.05.05.05.05.07.016.033.05.05.05.05.05.07.010.014.030.0+125°C(µA)6.06.06.06.06.07.210.816.833.66.06.06.06.06.08.418.039.66.06.06.06.06.08.419.239.66.06.06.06.06.08.412.016.836.0-55°C(%)9999999996999999969999999666999999Max.ESR100 kHz(Ω)8.08.08.05.54.53.53.02.21.110.08.08.05.54.53.52.51.112.010.08.05.55.04.02.51.114.012.010.06.05.04.03.02.41.1AAABBBCCDAAABBBCDAAABBBCDAAABBBCCDNOTE:To complete the MIL-C-55365/8 Part Number, additional information
must be added:
* = Termination FinishB = Gold Plated
C = Hot Solder DippedK = Solder Fused
† = Tolerance Code
J = ±5%K = ±10%M = ±20%
Contact your local AVX sales office for latest qualification status.
᭝= Optional Surge Current
A = 10 cycles at 25°CB = 10 cycles at -55°C
and +85°C
ᮀ= PackagingBulk Standard
\\TR=7\" Tape & Reel\\TR13=13\" Tape & Reel\\W=Waffle Pack
@ = Failure Rate LevelExponential:
M = 1.0% per 1000 hoursP = 0.1% per 1000 hoursR = 0.01% per 1000 hoursS = 0.001% per 1000 hoursWeibull:
B = 0.1% per 1000 hoursC = 0.01% per 1000 hoursD = 0.001% Per 1000 hours
26
CWR11 Style
MIL-C-55365/8
ELECTRICAL RATINGS FOR CWR11 CAPACITORS
MIL-C-55365/8PartNumber(See Note)CWR11K*334†@᭝ᮀCWR11K*474†@᭝ᮀCWR11K*684†@᭝ᮀCWR11K*105†@᭝ᮀCWR11K*155†@᭝ᮀCWR11K*225†@᭝ᮀCWR11K*335†@᭝ᮀCWR11K*475†@᭝ᮀCWR11K*685†@᭝ᮀCWR11K*106†@᭝ᮀCWR11M*104†@᭝ᮀCWR11M*154†@᭝ᮀCWR11M*224†@᭝ᮀCWR11M*334†@᭝ᮀCWR11M*474†@᭝ᮀCWR11M*684†@᭝ᮀCWR11M*105†@᭝ᮀCWR11M*155†@᭝ᮀCWR11M*225†@᭝ᮀCWR11M*335†@᭝ᮀCWR11M*475†@᭝ᮀCWR11N*104†@᭝ᮀCWR11N*154†@᭝ᮀCWR11N*224†@᭝ᮀCWR11N*334†@᭝ᮀCWR11N*474†@᭝ᮀCWR11N*684†@᭝ᮀCWR11N*105†@᭝ᮀCWR11N*155†@᭝ᮀCWR11N*225†@᭝ᮀCaseSizeRatedVoltage(85°C)(volts)252525252525252525253535353535353535353535505050505050505050Capacitance(nom.)(µF)0.330.470.681.01.52.23.34.76.810.00.100.150.220.330.470.681.01.52.23.34.70.100.150.220.330.470.681.01.52.2DC Leakage (max.)+25°C(µA)0.50.50.50.50.50.60.91.21.72.50.50.50.50.50.50.50.50.50.81.21.70.50.50.50.50.50.50.50.81.1Dissipation Factor (max.)+25°C+85/125°C(%)(%)444466664444466444666666669866666668888666666688+85°C(µA)5.05.05.05.05.06.09.012.017.025.05.05.05.05.05.05.05.05.08.012.017.05.05.05.05.05.05.05.08.011.0+125°C(µA)6.06.06.06.06.07.210.814.420.430.06.06.06.06.06.06.06.06.09.614.420.46.06.06.06.06.06.06.09.613.2-55°C(%)666699999966666669999666666699Max.ESR100 kHz(Ω)15.014.07.56.56.53.53.52.51.41.224.021.018.015.010.08.06.54.53.52.51.522.017.014.012.08.07.06.04.02.5AABBBCCCDDAAAABBBCCCDABBBCCCDDNOTE:To complete the MIL-C-55365/8 Part Number, additional information
must be added:* = Termination FinishDesignator:
B = Gold Plated
C = Hot Solder DippedK = Solder Fused
† = Tolerance Code
J = ±5%K = ±10%M = ±20%
Contact your local AVX sales office for latest qualification status.
@ = Failure Rate LevelExponential:
M = 1.0% per 1000 hoursP = 0.1% per 1000 hoursR = 0.01% per 1000 hoursS = 0.001% per 1000 hoursWeibull:
B = 0.1% per 1000 hoursC = 0.01% per 1000 hoursD = 0.001% per 1000 hours
᭝= Optional Surge Current
A = 10 cycles at 25°CB = 10 cycles at -55°C
and +85°C
ᮀ= PackagingBulk Standard
\\TR=7\" Tape & Reel\\TR13=13\" Tape & Reel\\W=Waffle Pack
27
Technical Summary and Application Guidelines
INTRODUCTION
Tantalum capacitors are manufactured from a powder ofpure tantalum metal. The typical particle size is between 2and 10 µm.
Rearranging this equation gives:
A=Cdor4000µFV10000µFV
Figure 1.
20000µFV
The powder is compressed under high pressure around aTantalum wire to form a ‘pellet’ (known as the Riser Wire).The riser wire is the anode connection to the capacitor.
This is subsequently vacuum sintered at high temperature(typically 1500 - 2000°C). This helps to drive off any impuri-ties within the powder by migration to the surface.
During sintering the powder becomes a sponge like structure with all the particles interconnected in a huge lattice.
This structure is of high mechanical strength and density, butis also highly porous giving a large internal surface area (see Figure 2).
The larger the surface area the larger the capacitance. Thushigh CV (capacitance/voltage product) powders, which havea low average particle size, are used for low voltage, highcapacitance parts. The figure below shows typical powders.Note the very great difference in particle size between thepowder CVs.
By choosing which powder is used to produce each capac-itance/voltage rating the surface area can be controlled.
The following example uses a 22µF 25V capacitor to illustrate the point.
AC=ordthus for a 22µF/25V capacitor the surface area is 150 squarecentimeters, or nearly half the size of this page.
The dielectric is then formed over all the tantalum surfacesby the electrochemical process of anodization. To achievethis, the ‘pellet’ is dipped into a very weak solution of phos-phoric acid.
The dielectric thickness is controlled by the voltage appliedduring the forming process. Initially the power supply is keptin a constant current mode until the correct thickness ofdielectric has been reached (that is the voltage reaches the‘forming voltage’), it then switches to constant voltage modeand the current decays to close to zero.
Figure 2. Sintered Tantalum
The chemical equations describing the process are asfollows:
Anode:Cathode:2 Ta →2 Ta5++ 10 e2 Ta5+ 10 OH-→Ta2O5+ 5 H2O10 H2O – 10 e →5H2↑+ 10 OH-where (8.855 x 10-12Farads/m)ris the relative dielectric constant for Tantalum Pentoxide (27)d is the dielectric thickness in meters(for a typical 25V part)C is the capacitance in FaradsA is the surface area in metersois the dielectric constant of free spaceThe oxide forms on the surface of the Tantalum but it alsogrows into the metal. For each unit of oxide two thirds growsout and one third grows in. It is for this reason that there is alimit on the maximum voltage rating of Tantalum capacitorswith present technology powders (see Figure 3).
The dielectric operates under high electrical stress. Considera 22µF 25V part:
Formation voltage= Formation Ratio x Working Voltage
= 4 x 25= 100 Volts
and 28
Technical Summary and Application Guidelines
The pentoxide (Ta2O5) dielectric grows at a rate of 1.7 x 10-9m/V
Dielectric thickness (d)= 100 x 1.7 x 10-9
= 0.17 µm
Electric Field strength= Working Voltage / d
= 147 KV/mmTantalum ManganeseDioxideTantalumDielectricOxide FilmFigure 4. Manganese Dioxide LayerDielectric Oxide FilmFigure 3. Dielectric LayerThe next stage is the production of the cathode plate. This isachieved by pyrolysis of Manganese Nitrate into ManganeseDioxide.
The ‘pellet’ is dipped into an aqueous solution of nitrate andthen baked in an oven at approximately 250°C to producethe dioxide coat. The chemical equation is:
Mn (NO3)2→Mn O2+ 2NO2↑
This process is repeated several times through varyingspecific densities of nitrate to build up a thick coat over all internal and external surfaces of the ‘pellet’, as shown inFigure 4.
The ‘pellet’ is then dipped into graphite and silver to provide a good connection to the Manganese Dioxide cathode plate. Electrical contact is established by depositionof carbon onto the surface of the cathode. The carbon is then coated with a conductive material to facilitate connection to the cathode termination. Packaging is carriedout to meet individual specifications and customer require-ments. This manufacturing technique is adhered to for thewhole range of AVX tantalum capacitors, which can be sub-divided into four basic groups: Chip / Resin dipped /Rectangular boxed / Axial.
Further information on the production of TantalumCapacitors can be obtained from the technical paper \"BasicTantalum Technology\AVX representative.
Anode
ManganeseDioxide
Graphite
OuterSilver LayerSilverEpoxyCathodeConnection
29
Technical Summary and Application Guidelines
SECTION 1
ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS1.1 CAPACITANCE
1.1.1 Rated capacitance (CR).
This is the nominal rated capacitance. For tantalum capaci-tors it is measured as the capacitance of the equivalentseries circuit at 20°C using a measuring bridge supplied by a0.5Vpk-pk 120Hz sinusoidal signal, free of harmonics with amaximum bias of 2.2Vd.c.
1.2 VOLTAGE
1.2.1 Rated d.c. voltage (VR)
This is the rated d.c. voltage for continuous operation at85°C.
1.2.2 Category voltage (VC)
1.1.2 Capacitance tolerance.
This is the permissible variation of the actual value of thecapacitance from the rated value. For additional reading,please consult the AVX technical publication \"CapacitanceTolerances for Solid Tantalum Capacitors\".
This is the maximum voltage that may be applied continu-ously to a capacitor. It is equal to the rated voltage up to+85°C, beyond which it is subject to a linear derating, to 2/3VRat 125°C.
1.1.3 Temperature dependence of capacitance.
The capacitance of a tantalum capacitor varies with temper-ature. This variation itself is dependent to a small extent onthe rated voltage and capacitor size.
1.2.3 Surge voltage (VS)
1.1.4 Frequency dependence of the capacitance.
The effective capacitance decreases as frequency increases.Beyond 100KHz the capacitance continues to drop until res-onance is reached (typically between 0.5 - 5MHz dependingon the rating). Beyond the resonant frequency the devicebecomes inductive.
TAJE227K010
CAPACITANCE vs. FREQUENCY
250
This is the highest voltage that may be applied to a capaci-tor for short periods of time. The surge voltage may beapplied up to 10 times in an hour for periods of up to 30seconds at a time. The surge voltage must not be used as aparameter in the design of circuits in which, in the normalcourse of operation, the capacitor is periodically chargedand discharged.
85°CRatedVoltage(Vdc.)46.3101620253550SurgeVoltage(Vdc.)5.28132026324665CategoryVoltage(Vdc.)2.747.01013172333125°CSurgeVoltage(Vdc.)3.2581216202840200Capacitance (µF)150
1.2.4 Effect of surges
The solid Tantalum capacitor has a limited ability to withstandvoltage and current surges. This is in common with all otherelectrolytic capacitors and is due to the fact that they oper-ate under very high electrical stress across the dielectric. Forexample a 25 volt capacitor has an Electrical Field of 147KV/mm when operated at rated voltage.
100
50
0100
100010000Frequency (Hz)
1000001000000
30
Technical Summary and Application Guidelines
It is important to ensure that the voltage across the terminalsof the capacitor never exceeds the specified surge voltagerating.
Solid tantalum capacitors have a self healing ability providedby the Manganese Dioxide semiconducting layer used as thenegative plate. However, this is limited in low impedanceapplications.
In the case of low impedance circuits, the capacitor is likelyto be stressed by current surges. Derating the capacitor by50% or more increases the reliability of the component. (SeeFigure 2 page 37). The “AVX Recommended Derating Table”(page 38) summarizes voltage rating for use on commonvoltage rails, in low impedance applications.
In circuits which undergo rapid charge or discharge a pro-tective resistor of 1Ω/V is recommended. If this is impossible,a derating factor of up to 70% should be used.
In such situations a higher voltage may be needed than isavailable as a single capacitor. A series combination shouldbe used to increase the working voltage of the equivalentcapacitor: For example two 22µF 25V parts in series is equiv-alent to one 11µF 50V part. For further details refer to J.A.Gill’s paper “Investigation into the effects of connectingTantalum capacitors in series”, available from AVX officesworldwide.
The peak reverse voltage applied to the capacitor must notexceed:
10% of the rated d.c. working voltage to a maximum of
1.0v at 25°C
3% of the rated d.c. working voltage to a maximum of
0.5v at 85°C
1% of the category d.c. working voltage to a maximum of
0.1v at 125°C
1.2.6 Superimposed A.C. Voltage (Vr.m.s.) -
Ripple Voltage.
This is the maximum r.m.s. alternating voltage; superim-posed on a d.c. voltage, that may be applied to a capacitor.The sum of the d.c. voltage and peak value of the super-imposed a.c. voltage must not exceed the categoryvoltage, Vc.
Full details are given in Section 2.
1.2.7 Forming voltage.
This is the voltage at which the anode oxide is formed. Thethickness of this oxide layer is proportional to the formationvoltage for a tantalum capacitor and is a factor in setting therated voltage.
NOTE:
While testing a circuit (e.g. at ICT or functional) it is likely thatthe capacitors will be subjected to large voltage and currenttransients, which will not be seen in normal use. These con-ditions should be borne in mind when considering thecapacitor’s rated voltage for use. These can be controlled byensuring a correct test resistance is used.
1.3 DISSIPATION FACTOR AND
TANGENT OF LOSS ANGLE (TAN ␦)
1.3.1 Dissipation factor (D.F.).
Dissipation factor is the measurement of the tangent of theloss angle(tan ␦) expressed as a percentage. The measure-ment of DF is carried out using a measuring bridge whichsupplies a 0.5Vpk-pk 120Hz sinusoidal signal, free of har-monics with a maximum bias of 2.2Vdc. The value of DF istemperature and frequency dependent.
Note: For surface mounted products the maximum allowedDF values are indicated in the ratings table and it is importantto note that these are the limits met by the componentAFTER soldering onto the substrate.
1.2.5 Reverse voltage and Non-Polar operation.
The values quoted are the maximum levels of reverse voltagewhich should appear on the capacitors at any time. Theselimits are based on the assumption that the capacitors arepolarized in the correct direction for the majority of theirworking life. They are intended to cover short term reversalsof polarity such as those occurring during switching tran-sients of during a minor portion of an impressed waveform.Continuous application of reverse voltage without normalpolarization will result in a degradation of leakage current. Inconditions under which continuous application of a reversevoltage could occur two similar capacitors should be used ina back-to-back configuration with the negative terminationsconnected together. Under most conditions this combinationwill have a capacitance one half of the nominal capacitanceof either capacitor. Under conditions of isolated pulses orduring the first few cycles, the capacitance may approachthe full nominal value.
The reverse voltage ratings are designed to cover exception-al conditions of small level excursions into incorrect polarity.The values quoted are not intended to cover continuousreverse operation.
1.3.2 Tangent of Loss Angle (tan ␦).
This is a measurement of the energy loss in the capacitor. Itis expressed as tan ␦and is the power loss of the capacitordivided by its reactive power at a sinusoidal voltage of spec-ified frequency. Terms also used are power factor, loss factorand dielectric loss. Cos (90 - ␦) is the true power factor. Themeasurement of tan ␦is carried out using a measuringbridge which supplies a 0.5Vpk-pk 120Hz sinusoidal signal,free of harmonics with a maximum bias of 2.2Vdc.
31
Technical Summary and Application Guidelines
1.3.3 Frequency dependence of Dissipation Factor.
Dissipation Factor increases with frequency as shown in thetypical curves:
DF vs. FREQUENCY(TPSE107M016R0100)500450400350300DF (%)2502001501005001001000Frequency (Hz)100001000001.4.2 Equivalent Series Resistance, ESR.
Resistance losses occur in all practical forms of capacitors.These are made up from several different mechanisms,including resistance in components and contacts, viscousforces within the dielectric and defects producing bypasscurrent paths. To express the effect of these losses they areconsidered as the ESR of the capacitor. The ESR is frequencydependent and can be found by using the relationship;
tan δ
ESR =
2πfC
Where f is the frequency in Hz, and C is the capacitance infarads.
The ESR is measured at 20°C and 100kHz.
ESR is one of the contributing factors to impedance, and at high frequencies (100kHz and above) it becomes thedominant factor. Thus ESR and impedance become almostidentical, impedance being only marginally higher.
1.3.4 Temperature dependence of Dissipation
Factor.
Dissipation factor varies with temperature as the typicalcurves show. For maximum limits please refer to ratingstables.
DF vs. TEMPERATURE(TPSE107M016R0100)1.4.3 Frequency dependence of Impedance and ESR.
ESR and Impedance both increase with decreasing frequency.At lower frequencies the values diverge as the extra contri-butions to impedance (due to the reactance of the capacitor)become more significant. Beyond 1MHz (and beyond theresonant point of the capacitor) impedance again increasesdue to the inductance of the capacitor.
ESR vs. FREQUENCY(TPSE107M016R0100)1ESR (Ohms)-40-20020406080100125Temperature (°C)0.10.01100100010000Frequency (Hz)10000010000001.4 IMPEDANCE, (Z) AND EQUIVALENT
SERIES RESISTANCE (ESR)
1.4.1 Impedance, Z.
This is the ratio of voltage to current at a specified frequency.Three factors contribute to the impedance of a tantalumcapacitor; the resistance of the semiconductor layer; thecapacitance value and the inductance of the electrodes and leads.
At high frequencies the inductance of the leads becomes a limiting factor. The temperature and frequency behavior of these three factors of impedance determine the behaviorof the impedance Z. The impedance is measured at 20°Cand 100kHz.
Impedance (Ohms)10
IMPEDANCE vs. FREQUENCY
(TPSE107M016R0100)
1
0.1
0.01
100100010000Frequency (Hz)
100000100000032
Technical Summary and Application Guidelines
1.4.4 Temperature dependence of the Impedance
and ESR.
At 100kHz, impedance and ESR behave identically anddecrease with increasing temperature as the typical curvesshow.
1ESR vs. TEMPERATURE1.5.3 Voltage dependence of the leakage current.
The leakage current drops rapidly below the value corre-sponding to the rated voltage VRwhen reduced voltages areapplied. The effect of voltage derating on the leakage currentis shown in the graph. This will also give a significant increasein the reliability for any application. See Section 3.1 fordetails.
LEAKAGE CURRENT vs. RATED VOLTAGE
ESR (Ohms)1
0.10.01-55-40-20Leakage Currentratio I/IVR
0.1
TypicalRange0204060Temperature (°C)80101251.5 D.C. LEAKAGE CURRENT
1.5.1 Leakage current.
The leakage current is dependent on the voltage applied, the elapsed time since the voltage was applied and the component temperature. It is measured at +20°C with therated voltage applied. A protective resistance of1000Ωis connected in series with the capacitor in the measuring circuit. Three to five minutes after application of the ratedvoltage the leakage current must not exceed the maximumvalues indicated in the ratings table. These are based on theformulae 0.01CV or 0.5µA (whichever is the greater).
Reforming of tantalum capacitors is unnecessary even afterprolonged storage periods without the application of voltage.
0.01
020
4060
80100
Rated Voltage (VR) %
For additional information on Leakage Current, please consult the AVX technical publication \"Analysis of SolidTantalum Capacitor Leakage Current\" by R. W. Franklin.
1.5.4 Ripple current.
The maximum ripple current allowed can be calculated fromthe power dissipation limits for a given temperature riseabove ambienttemperature (please refer to Section 2).
LEAKAGE CURRENT vs. BIAS VOLTAGE
108Leakage Current (µA)20-2-4-6-8-10-200204060801001.5.2 Temperature dependence of the leakage
current.
The leakage current increases with higher temperatures, typical values are shown in the graph. For operation between85°C and 125°C, the maximum working voltage must bederated and can be found from the following formula.Vmax = 1- (T - 85)x VRvolts, where T is the required
125operating temperature.
ͧͨ LEAKAGE CURRENT vs. TEMPERATUREApplied Voltage (Volts)
10TAJD336M006TAJD476M010TAJD336M016TAJC685M020Leakage current1ratio I/IR200.1-55-40-20020406080100+125Temperature (°C)33
Technical Summary and Application Guidelines
SECTION 2
A.C. OPERATION, RIPPLE VOLTAGE AND RIPPLE CURRENT2.1 RIPPLE RATINGS (A.C.)
In an a.c. application heat is generated within the capacitorby both the a.c. component of the signal (which will dependupon the signal form, amplitude and frequency), and by thed.c. leakage. For practical purposes the second factor isinsignificant. The actual power dissipated in the capacitor iscalculated using the formula:
P = I2 Randrearranged to I = (P⁄R) .....(Eq. 1)and substitutingwhere
I
REPZ
P = ER
Z2
= rms ripple current, amperes
= equivalent series resistance, ohms= rms ripple voltage, volts= power dissipated, watts
= impedance, ohms, at frequency underconsideration
2
Where P is the maximum permissible power dissipated aslisted for the product under consideration (see tables).However care must be taken to ensure that:
1.The d.c. working voltage of the capacitor must not beexceeded by the sum of the positive peak of the applieda.c. voltage and the d.c. bias voltage.2.The sum of the applied d.c. bias voltage and the negativepeak of the a.c. voltage must not allow a voltage reversalin excess of the “Reverse Voltage”.
√Historical ripple calculations.
Previous ripple current and voltage values were calculatedusing an empirically derived power dissipation required togive a 10°C rise of the capacitors body temperature fromroom temperature, usually in free air. These values are shownin Table I. Equation 1 then allows the maximum ripple currentto be established, and Equation 2, the maximum ripple voltage. But as has been shown in the AVX article on thermalmanagement by I. Salisbury, the thermal conductivity of aTantalum chip capacitor varies considerably depending uponhow it is mounted.
Maximum a.c. ripple voltage (Emax).From the previous equation:
E max= Z (P⁄R) .....(Eq. 2)
√Table I: Power Dissipation Ratings (In Free Air)
TAJ/TPS/CWR11Series Molded ChipCasesizeABCDEMNRSTVMax. powerdissipation (W)0.0750.0850.1100.1500.1650.0900.1300.0550.0650.0800.250TAZ/CWR09Series Molded ChipCasesizeABCDEFGHMax. powerdissipation (W)0.0500.0700.0750.0800.0900.1000.1250.150TAJ/TPS/CWR11TAZ/CWR09Series Molded ChipTemperaturederating factorsTemp. °CFactor+251.0+550.90+850.80+1250.16Temperature correction factorfor ripple currentTemp. °CFactor+251.0+550.95+850.90+1250.4034
Technical Summary and Application Guidelines
A piece of equipment was designed which would pass sineand square wave currents of varying amplitudes through abiased capacitor. The temperature rise seen on the body forthe capacitor was then measured using an infra-red probe.This ensured that there was no heat loss through any ther-mocouple attached to the capacitor’s surface.Results for the C, D and E case sizes
10090807060504030201000 7060Temperature rise (°C)504030201000.00
100KHz1 MHzTemperature rise ( o C ) 0.20
0.400.600.80
RMS current (Amps)
1.001.20
C caseD caseE caseIf I2R is then plotted it can be seen that the two lines are infact coincident, as shown in figure below.
70.0060.00Temperature Rise (°C)50.0040.0030.0020.0010.000.00
0.00
0.050.100.150.200.250.300.350.40
FR
0.450.50
100KHz1 MHz0.10.20.30.40.5Power (Watts)
Several capacitors were tested and the combined results areshown here. All these capacitors were measured on FR4board, with no other heatsinking. The ripple was supplied atvarious frequencies from 1KHz to 1MHz.
As can be seen in the figure above, the average Pmaxvaluefor the C case capacitors was 0.11 Watts. This is the sameas that quoted in Table I.
The D case capacitors gave an average Pmaxvalue 0.125Watts. This is lower than the value quoted in the Table I by0.025 Watts.
The E case capacitors gave an average Pmaxof 0.200 Wattswhich was much higher than the 0.165 Watts from Table I.If a typical capacitor’s ESR with frequency is considered, e.g.figure below, it can be seen that there is variation. Thus for aset ripple current, the amount of power to be dissipated bythe capacitor will vary with frequency. This is clearly shown infigure in top of next column, which shows that the surfacetemperature of the unit rises less for a given value of ripplecurrent at 1MHz than at 100KHz.
The graph below shows a typical ESR variation with fre-quency. Typical ripple current versus temperature rise for100KHz and 1MHz sine wave inputs.
ESR vs. FREQUENCY
(TPSE107M016R0100)1
Example
A Tantalum capacitor is being used in a filtering application,where it will be required to handle a 2 Amp peak-to-peak,200KHz square wave current.
A square wave is the sum of an infinite series of sine wavesat all the odd harmonics of the square waves fundamentalfrequency. The equation which relates is:
ISquare= Ipksin (2πƒ) + Ipksin (6πƒ) + Ipksin (10πƒ) + Ipksin (14πƒ) +...
Thus the special components are:
Frequency200 KHz600 KHz1 MHz1.4 MHzPeak-to-peak current(Amps)2.0000.6670.400 0.286RMS current(Amps)0.7070.2360.1410.101Let us assume the capacitor is a TAJD686M006Typical ESR measurements would yield.
Frequency200 KHz600 KHz1 MHz1.4 MHzTypical ESR (Ohms)0.1200.1150.090 0.100Power (Watts)Irms2x ESR0.0600.0060.0020.001ESR (Ohms)0.1
0.01
100
100010000Frequency (Hz)
1000001000000
Thus the total power dissipation would be 0.069 Watts.
From the D case results shown in figure top of previous column, it can be seen that this power would cause thecapacitors surface temperature to rise by about 5°C. For additional information, please refer to the AVX technicalpublication “Ripple Rating of Tantalum Chip Capacitors” byR.W. Franklin.
35
Technical Summary and Application Guidelines
2.2 Thermal Management
The heat generated inside a tantalum capacitor in a.c. operation comes from the power dissipation due to ripplecurrent. It is equal to I2R, where I is the rms value of the current at a given frequency, and R is the ESR at the samefrequency with an additional contribution due to the leakagecurrent. The heat will be transferred from the outer surface byconduction. How efficiently it is transferred from this point isdependent on the thermal management of the board.
The power dissipation ratings given in Section 2.1 are basedon free-air calculations. These ratings can be approached ifefficient heat sinking and/or forced cooling is used.
In practice, in a high density assembly with no specificthermal management, the power dissipation required to givea 10°C rise above ambient may be up to a factor of 10 less. In these cases, the actual capacitor temperature should be established (either by thermocouple probe or infra-redscanner) and if it is seen to be above this limit it may be necessary to specify a lower ESR part or a higher voltage rating.
Please contact application engineering for details or contactthe AVX technical publication entitled “Thermal Managementof Surface Mounted Tantalum Capacitors” by Ian Salisbury.
Thermal Dissipation from the Mounted Chip
ENCAPSULANTLEAD FRAMETANTALUMANODESOLDERCOPPERPRINTED CIRCUIT BOARDThermal Impedance Graph with Ripple Current
THERMAL IMPEDANCE GRAPHC CASE SIZE CAPACITOR BODY
14012010080604020XXXTEMPERATURE DEG C121 C\\WATT236 C\\WATT73 C\\WATTX - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY00 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4POWER IN UNIT CASE, DC WATTS
= PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP= CAP IN FREE AIR36
Technical Summary and Application Guidelines
SECTION 3
RELIABILITY AND CALCULATION OF FAILURE RATE3.1 STEADY-STATE
Tantalum Dielectric has essentially no wear out mechanismand in certain circumstances is capable of limited self healing. However, random failures can occur in operation.The failure rate of Tantalum capacitors will decrease with timeand not increase as with other electrolytic capacitors andother electronic components.
Figure 2. Correction factor to failure rate F for voltage derating of a typical component (60% con. level).
1.0000Correction Factor0.10000.0100Infant
Mortalities
0.00100.000100.10.20.30.40.50.60.70.80.91Applied Voltage / Rated Voltage
Infinite Useful Life
Useful life reliability can be altered by voltagederating, temperature or series resistance
Operating Temperature.
If the operating temperature is below the rated temperaturefor the capacitor then the operating reliability will be improvedas shown in Figure 3. This graph gives a correction factor FTfor any temperature of operation.
Figure 3: Correction factor to failure rate F for ambient
temperature T for typical component
(60% con. level).
100.0Figure 1. Tantalum Reliability Curve
The useful life reliability of the Tantalum capacitor is affectedby three factors. The equation from which the failure rate canbe calculated is:
F = FU x FT x FR x FBwhere
FU is a correction factor due to operating voltage/voltage derating
FT is a correction factor due to operatingtemperature
FR is a correction factor due to circuit seriesresistance
FB is the basic failure rate level. For standardTantalum product this is 1%/1000 hours
Correction Factor10.01.00.10Base failure rate.
Standard tantalum product conforms to Level M reliability(i.e., 1%/1000 hrs.) at rated voltage, rated temperature, and 0.1Ω/volt circuit impedance. This is known as the base failure rate, FB, which is used for calculating operatingreliability. The effect of varying the operating conditions onfailure rate is shown on this page.
0.012030405060708090100110120Temperature
Circuit Impedance.
All solid tantalum capacitors require current limiting resistance to protect the dielectric from surges. A seriesresistor is recommended for this purpose. A lower circuitimpedance may cause an increase in failure rate, especiallyat temperatures higher than 20°C. An inductive low imped-ance circuit may apply voltage surges to the capacitor andsimilarly a non-inductive circuit may apply current surges tothe capacitor, causing localized over-heating and failure. Therecommended impedance is 1 Ωper volt. Where this is notfeasible, equivalent voltage derating should be used (See MIL HANDBOOK 217E). The graph, Figure 4, showsthe correction factor, FR, for increasing series resistance.
Operating voltage/voltage derating.
If a capacitor with a higher voltage rating than the maximumline voltage is used, then the operating reliability will beimproved. This is known as voltage derating.
The graph, Figure 2, shows the relationship between voltagederating (the ratio between applied and rated voltage) andthe failure rate. The graph gives the correction factor FU forany operating voltage.
37
Technical Summary and Application Guidelines
Figure 4. Correction factor to failure rate F for series resistanceR on basic failure rate FB for a typical component (60% con. level).Circuit resistance ohms/volt3.02.01.00.80.60.40.20.1FR0.070.10.20.30.40.60.81.0As can clearly be seen from the results of this experiment,the more derating applied by the user, the less likely theprobability of a surge failure occurring.It must be remembered that these results were derived froma highly accelerated surge test machine, and failure rates inthe low ppm are more likely with the end customer.A commonly held misconception is that the leakage currentof a Tantalum capacitor can predict the number of failureswhich will be seen on a surge screen. This can be disprovedby the results of an experiment carried out at AVX on 47µF10V surface mount capacitors with different leakage currents. The results are summarized in the table below.Example calculationConsider a 12 volt power line. The designer needs about10µF of capacitance to act as a decoupling capacitor near avideo bandwidth amplifier. Thus the circuit impedance will belimited only by the output impedance of the board’s powerunit and the track resistance. Let us assume it to be about 2 Ohms minimum, i.e. 0.167 Ohms/Volt. The operating temperature range is -25°C to +85°C. If a 10µF 16 Voltcapacitor was designed in the operating failure rate would be as follows.a)FT = 1.0 @ 85°Cb)FR = 0.85 @ 0.167 Ohms/Voltc)FU = 0.08 @ applied voltage/rated voltage = 75%ThusFB = 1.0 x 0.85 x 0.08 x 1 = 0.068%/1000 HoursIf the capacitor was changed for a 20 volt capacitor, theoperating failure rate will change as shown.FU = 0.018 @ applied voltage/rated voltage = 60%FB = 1.0 x 0.85 x 0.018 x 1 = 0.0153%/1000 HoursLeakage current vs number of surge failuresStandard leakage range 0.1 µA to 1µAOver Catalog limit5µA to 50µAClassified Short Circuit50µA to 500µANumber tested10,00010,00010,000Number failed surge252625Again, it must be remembered that these results werederived from a highly accelerated surge test machine,and failure rates in the low ppm are more likely with the endcustomer.AVX recommended derating tableVoltage Rail3.35101215≥24Working Cap Voltage6.310202535Series Combinations (11)3.2 Dynamic.As stated in Section 1.2.4, the solid Tantalum capacitor hasa limited ability to withstand voltage and current surges.Such current surges can cause a capacitor to fail. Theexpected failure rate cannot be calculated by a simple formula as in the case of steady-state reliability. The twoparameters under the control of the circuit design engineerknown to reduce the incidence of failures are derating andseries resistance.The table below summarizes the results of trials carried outat AVX with a piece of equipment which has very low seriesresistance with no voltagederating applied. That is thecapacitor was tested at its rated voltage.For further details on surge in Tantalum capacitors refer to J.A. Gill’s paper “Surge in solid Tantalum capacitors”,available from AVX offices worldwide.An added bonus of increasing the derating applied in a circuit, to improve the ability of the capacitor to withstandsurge conditions, is that the steady-state reliability isimproved by up to an order. Consider the example of a 6.3volt capacitor being used on a 5 volt rail.The steady-state reliability of a Tantalum capacitor is affectedby three parameters; temperature, series resistance andvoltage derating. Assume 40°C operation and 0.1Ohms/Volt series resistance. Results of production scale derating experimentCapacitance and Voltage47µF 16V100µF 10V22µF 25VNumber of units tested1,547,587632,8762,256,25850% deratingapplied0.03%0.01%0.05%No deratingapplied1.1%0.5%0.3%38
Technical Summary and Application Guidelines
The capacitors reliability will therefore be:
Failure rate = FUx FTx FRx 1%/1000 hours
=0.15 x 0.1 x 1 x 1%/1000 hours=0.015%/1000 hours
If a 10 volt capacitor was used instead, the new scaling factorwould be 0.006, thus the steady-state reliability would be:
Failure rate = FUx FTx FRx 1%/1000 hours
=0.006 x 0.1 x 1 x 1%/1000 hours=6 x 10-4%/1000 hours
SECTION 4
APPLICATION GUIDELINES FOR TANTALUM CAPACITORS
So there is an order improvement in the capacitors steady-state reliability.
ture and is designed to ensure that the temperature ofthe internal construction of the capacitor does not exceed220°C. Preheat conditions vary according to the reflow system used, maximum time and temperature would be 10minutes at 150°C. Small parametric shifts may be notedimmediately after reflow, components should be allowed tostabilize at room temperature prior to electrical testing.
Both TAJ and TAZ series are designed for reflow and wavesoldering operations. In addition TAZ is available with goldterminations compatible with conductive epoxy or gold wirebonding for hybrid assemblies.
Soldering Conditions and Board Attachment.
The soldering temperature and time should be the minimumfor a good connection.
A suitable combination for wavesoldering is 230 - 250°C for3 - 5 seconds.
For vapor phase or infra-red reflow soldering the profilebelow shows allowable and dangerous time/temperaturecombinations. The profile refers to the peak reflow tempera-
Allowable range of peak temp./time combination for wave soldering270260250Temperature240(o C)
230220210200Allowable Range with Preheat0 2 4 6 8 10 12 Soldering Time (secs.)
Dangerous RangeUnder the CECC 00 802International Specification, AVXTantalum capacitors are aClass A component.
The capacitors can thereforebe subjected to one IR reflow,one wave solder and one soldering iron cycle.
If more aggressive mountingtechniques are to be usedplease consult AVX Tantalumfor guidance.
Allowable Rangewith Care
Allowable range of peak temp./time combination for IR reflow
260
DANGEROUS RANGETemperature ( o C)250240230RECOMMENDED RANGE220210
ALLOWABLERANGE WITH CARE0 15 30 45 60TIME IN SECONDS
39
Technical Summary and Application Guidelines
SECTION 4
APPLICATION GUIDELINES FOR TANTALUM CAPACITORS
Recommended soldering profiles for surface mounting of tantalum capacitors is provided in figure below.
IR REFLOW
RecommendedRamp Rate Lessthan 2°C/sec.
WAVE SOLDERING
VAPOR PHASE
After soldering the assembly should preferably be allowed to cool naturally. In the event that assisted cooling is used, the rateof change in temperature should not exceed that used in reflow.
40
Technical Summary and Application Guidelines
SECTION 5
MECHANICAL AND THERMAL PROPERTIES OF CAPACITORS
5.1 Acceleration
98.1m/s2(10g)
DCzBYxPWA5.2 Vibration Severity
10 to 2000Hz, 0.75mm of 98.1m/s2(10g)
5.3 Shock
Trapezoidal Pulse, 98.1m/s2for 6ms.
5.4 Adhesion to Substrate
IEC 384-3. minimum of 5N.
PLPSPSL5.5Resistance to Substrate Bending
The component has compliant leads which reduces the risk of stress on the capacitor due to substratebending.
5.6 Soldering Conditions
Dip soldering is permissible provided the solder bathtemperature is ≤270°C, the solder time < 3 secondsand the circuit board thickness ≥1.0mm.
Dimensions PS (Pad Separation) and PW (Pad Width) arecalculated using dimensions x and z. Dimension y may vary, depending on whether reflow or wave soldering is to be performed.
For reflow soldering, dimensions PL (Pad Length), PW (PadWidth), and PSL (Pad Set Length) have been calculated. Forwave soldering the pad width (PWw) is reduced to less thanthe termination width to minimize the amount of solder pickup while ensuring that a good joint can be produced.
NOTE:These recommendations (also in compliance with EIA) are guidelines
only. With care and control, smaller footprints may be considered forreflow soldering.
5.7 Installation Instructions
The upper temperature limit (maximum capacitor surfacetemperature) must not be exceeded evenunder themost unfavorable conditions when the capacitor isinstalled. This must be considered particularly when it is positioned near components which radiate heatstrongly (e.g. valves and power transistors).Furthermore, care must be taken, when bending the wires, that the bending forces do not strain thecapacitor housing.Nominal footprint and pad dimensions for each case size aregiven in the following tables:
PAD DIMENSIONS:millimeters (inches)CASETAJABCDVERSTTACLRTAZ A BDEFGHPSL4.0 (0.157)4.0 (0.157)6.5 (0.056)8.0 (0.315)8.3 (0.325)8.0 (0.315)2.7 (0.100)4.0 (0.160)4.0 (0.160)2.4 (0.095)3.0 (0.120)3.3 (0.126)4.5 (0.178)4.5 (0.178)5.8 (0.228)6.3 (0.248)7.4 (0.293)8.0 (0.313)PL1.4 (0.054)1.4 (0.054)2.0 (0.079)2.0 (0.079)2.3 (0.090)2.0 (0.079)1.0 (0.040)1.4 (0.050)1.4 (0.050)0.7 (0.027)0.7 (0.027)1.4 (0.054)1.4 (0.054)1.4 (0.054)1.4 (0.054)1.4 (0.054)1.9 (0.074)1.9 (0.074)PS1.2 (0.047)1.2 (0.047)2.5 (0.098)4.0 (0.157)3.7 (0.145)4.0 (0.157)1.0 (0.040)1.0 (0.040)1.0 (0.040)0.9 (0.035)1.6 (0.063)0.5 (0.020)1.8 (0.070)1.8 (0.070)3.0 (0.120)3.6 (0.140)3.7 (0.145)4.2 (0.165)PW1.8 (0.071)2.8 (0.110)2.8 (0.110)3.0 (0.119)6.2 (0.245)3.0 (0.119)1.6 (0.060)1.8 (0.070)2.8 (0.110)1.0 (0.039)1.5 (0.059)2.5 (0.098)2.5 (0.098)3.6 (0.143)3.6 (0.143)4.5 (0.178)4.0 (0.157)5.0 (0.197)PWw0.9 (0.035)1.6 (0.063)1.6 (0.063)1.7 (0.068)1.7 (0.068)1.7 (0.068)0.8 (0.030)0.8 (0.030)0.8 (0.030)--1.0 (0.039)1.0 (0.039)2.0 (0.079)2.2 (0.085)3.0 (0.119)2.4 (0.095)3.4 (0.135)5.8 Installation PositionNo restriction.5.9 Soldering InstructionsFluxes containing acids must not be used.5.9.1 Guidelines for Surface Mount FootprintsComponent footprint and reflow pad design for AVXcapacitors.The component footprint is defined as the maximum boardarea taken up by the terminators. The footprint dimensionsare given by A, B, C and D in the diagram, which corre-sponds to W, max., A max., S min. and L max. for the com-ponent. The footprint is symmetric about the center lines.The dimensions x, y and z should be kept to a minimum to reduce rotational tendencies while allowing for visualinspection of the component and its solder fillet.SECTION 6EPOXY FLAMMABILITYEPOXYUL RATINGOXYGEN INDEX35%35%35%TAJ UL94 V-0TPS UL94 V-0TAZ UL94 V-0SECTION 7QUALIFICATION APPROVAL STATUSDESCRIPTIONSurface mount capacitorsSTYLETAJSPECIFICATIONCECC 30801 - 005 Issue 2CECC 30801 - 011 Issue 1MIL-C-55365/8 (CWR11)MIL-C-55365/4 (CWR09)TAZ41
TAC, TAJ & TPS Series
Tape and Reel Packaging
Tape and reel packaging for automatic component placement. Please enter required Suffix on order. Bulk product is not available.
TAC, TAJ AND TPS TAPING SUFFIX TABLE
Case SizeTape widthreferencemmABCDEVRSTTACLTACR881212121288888Pmm44888844444XX500500103mm (4\") reel180mm(7\") reel330mm(13\") reelTotal Tape Thickness — K maxTAC/TAJ/TPSCase sizereferenceABCDEVRSTLK2.3 (0.090)2.6 (0.102)3.3 (0.130)3.6 (0.142)4.8 (0.1)4.0 (0.156)1.9 (0.075)1.9 (0.075)1.9 (0.075)1.1 (0.043)Ao1.93.13.74.84.56.41.71.93.11.1Bo3.53.86.97.67.57.62.53.53.82.0SuffixQty.SuffixRRRRRRRRRRRQty.2000200050050040040025002500250035002500SSSSSSSSS800080003000250015001500100001000010000PLASTIC TAPE DIMENSIONS
CodeP*GFEWP2P0DD14±0.1or8±0.10.75 min8mm Tape 12mm Tape(0.157±0.004)(0.315±0.004)(0.03 min)4±0.1or8±0.10.75 min5.5±0.051.75±0.112±0.32±0.054±0.11.5±0.1-01.5 min(0.157±0.004)(0.315±0.004)(0.03 min)(0.22±0.002)(0.069±0.004)(0.472±0.012)(0.079±0.002)(0.157±0.004)(0.059±0.004)(-0)(0.059 min)P2Standard Dimensions mm
A: 9.5mm (8mm tape)13.0mm (12mm tape)
Cover Tape Dimensions
Thickness: 75±25µWidth of tape:
5.5mm + 0.2mm (8mm tape)9.5mm + 0.2mm (12mm tape)
3.5±0.05(0.138±0.002)1.75±0.1(0.069±0.004)8±0.32±0.054±0.11.5±0.1-01.0 min(0.315±0.012)(0.079±0.002)(0.157±0.004)(0.059±0.004)(-0)(0.039 min)*See taping suffix tables for actual P dimension (component pitch).
TAPE SPECIFICATION
Tape dimensions comply to EIA RS 481A
Dimensions A0and B0of the pocket and the tape thickness, K,are dependent on the component size.
Tape materials do not affect component solderability duringstorage. Carrier Tape Thickness <0.4mm
PP0DEFB0GWD1Positive TerminationA0K42
TAJ & TPS Marking
MARKING: TAJ SERIES
For TAJ, the positive end of body has videcon readablepolarity bar marking, with the AVX logo “A” as shown in thediagram. Bodies are marked by indelible laser marking on topsurface with capacitance value, voltage and date ofmanufacture. Due to the small size of the A, B, S and Tcases, a voltage code is used as shown to the right. R caseis an exception in which only the voltage and capacitancevalues are printed.
Voltage CodeA, B, S and T CasesFGJACDEVTRated Voltageat 85°C246.3101620253550POLARITY BAR INDICATES ANODE (+) TERMINATION
R Case:
1. Voltage
2. Capacitance in µF
2µ26VA, B, S and T Case:
A10µ98141. Voltage Code(see table)
2. Capacitance in µF3. Date Code
A68µ6.39819C, D, E and V Case:
1. Capacitance in µF2. Rated Voltage at 85°C3. Date Code
43
TAZ, CWR09, CWR11 Series
Tape and Reel Packaging
Solid Tantalum Chip TAZ Tape and reel packaging for automatic component placement.Please enter required Suffix on order. Bulk packaging is standard.
TAZ TAPING SUFFIX TABLE
Case SizereferenceABDEFGHTape widthmm8121212121212Pmm44448887\" (180mm) reel13\" reel (330mm) reelSuffixRRRRRRRQty.25002500250025001000500500SuffixSSSSSSSQty.9000900080008000300025002500Total Tape Thickness — K maxTAZCase sizeMillimeters (Inches)referenceDIMABDEFGH2.0 (0.079)4.0 (0.157)4.0 (0.157)4.0 (0.157)4.0 (0.157)4.0 (0.157)4.0 (0.157)CodeP*GFEWP2P0DD14±0.1or8±0.10.75 min8mm Tape 12mm Tape(0.157±0.004)(0.315±0.004)(0.03 min)4±0.1or8±0.10.75 min5.5±0.051.75±0.112±0.32±0.054±0.11.5±0.1-01.5 min(0.157±0.004)(0.315±0.004)(0.03 min)(0.22±0.002)(0.069±0.004)(0.472±0.012)(0.079±0.002)(0.157±0.004)(0.059±0.004)(-0)(0.059 min)3.5±0.05(0.138±0.002)1.75±0.1(0.069±0.004)8±0.32±0.054±0.11.5±0.1-01.0 min(0.315±0.012)(0.079±0.002)(0.157±0.004)(0.059±0.004)(-0)(0.039 min)*See taping suffix tables for actual P dimension (component pitch).
TAPE SPECIFICATION
Tape dimensions comply to EIA RS 481ADimensions A0and B0of the pocket andthe tape thickness, K, are dependent onthe component size.
Tape materials do not affect componentsolderability during storage.Carrier Tape Thickness <0.4mm
44
TAZ, CWR09, CWR11 Series
Tape and Reel Packaging
PLASTICTAPEREELDIMENSIONS
᭡0.13±0.51 ± 1᭡Standard Dimensions mm
2᭡nxA: 9.5mm (8mm tape)ima13.0mm (12mm tape)
᭢ 0m 5D᭢Cover Tape Dimensions
Thickness: 75±25µWidth of tape:
᭢5.5mm + 0.2mm (8mm tape)9.5mm + 0.2mm (12mm tape)
2 ± 0.5᭢᭢A ± 1.0᭢᭢Waffle Packaging -2\" x 2\" hard plastic waffle trays. To order Wafflepackaging use a “W” in part numbers packaging position.MaximumCase SizeQuantityPer WaffleTAZ A160TAZ B112TAZ D88TAZ E60TAZ F48TAZ G50TAZ H28CWR11 A96CWR11 B72NOTE:Orientation of parts in waffle packsCWR11 C54varies by case size.CWR11 D2845
Questions & Answers
The two resistors are used to ensure that the leakage currents of the capacitors does not affect the circuit reliability, by ensuring that all the capacitors have half the working voltage across them.Question: What are the advantages of tantalum over othercapacitor technologies?Answer: 1.Tantalum capacitors have high volumetric efficiency.2.Electrical performance over temperature is very stable.3.They have a wide operating temperature range -55degrees C to +125 degrees C. 4.They have better frequency characteristics than aluminum electrolytics.5.No wear out mechanism. Because of their construction,solid tantalum capacitors do not degrade in perfor-mance or reliability over time.Question: How does TPS differ from your standard33µFproduct?16.5µF25VAnswer: TPS has been designed from the initial anode 50Vproduction stages for power supply applications. Special33µFmanufacturing processes provide the most robust capacitor25Vdielectric by maximizing the volumetric efficiency of thepackage. After manufacturing, parts are conditioned byeffective capacitance will be halved, so for greater than 60µF,being subjected to elevated temperature overvoltage burn infour such series combinations are required, as shown.applied for a minimum of two hours. Parts are monitored ona 100% basis for their direct current leakage performance atelevated temperatures. Parts are then subjected to a lowimpedance current surge. This current surge is performed ona 100% basis with each capacitor individually monitored. 33µF66µFAt this stage, the capacitor undergoes 100% test for 25Vcapacitance, Dissipation Factor, leakage current, and 50V100 KHz ESR to TPS requirements. Question: If the part is rated as a 25 volt part and you havecurrent surged it, why can’t I use it at 25 volts in a lowIn order to ensure reliable operation, the capacitors shouldimpedance circuit?be connected as shown below to allow current sharing ofAnswer: The high volumetric efficiency obtained using the ac noise and ripple signals. This prevents any onetantalum technology is accomplished by using an extremelycapacitor heating more than its neighbors and thus beingthin film of tantalum pentoxide as the dielectric. Even the weak link in the chain.an application of the relatively low voltage of 25 volts will +produce a large field strength as seen by the dielectric. As a••result of this, derating has a significant impact on reliability as100Kdescribed under the reliability section. The following exampleuses a 22 microfarad capacitor rated at 25 volts to illustrate••••the point. The equation for determining the amount of 100Ksurface area for a capacitor is as follows:Some commonly asked questions regarding TantalumCapacitors:Question: If I use several tantalum capacitors in serial/parallelcombinations, how can I ensure equal current and voltagesharing?Answer: Connecting two or more capacitors in series and parallel combinations allows almost any value and rating to be constructed for use in an application. Forexample, a capacitance of more than 60µF is required in acircuit for stable operation. The working voltage rail is 24volts dc with a superimposed ripple of 1.5 volts at 120 Hz.The maximum voltage seen by the capacitor is Vdc+Vac=25.5VApplying the 50% derating rule tells us that a 50Vcapacitor is required.Connecting two 25V rated capacitors in series willgive the required capacitance voltage rating, but the¬¬••••100K46
Questions & Answers
C = ( (E) (E°) (A) ) / dA = ( (C) (d) ) /( (E°)(E) )
A = ( (22 x 10-6) (170 x 10-9) ) / ( (8.85 x 10-12) (27) )A = 0.015 square meters (150 square centimeters)Where
C = Capacitance in farads
A = Dielectric (Electrode) Surface Area (m2)
d = Dielectric thickness (Space between dielectric) (m)E = Dielectric constant (27 for tantalum)
E°= Dielectric Constant relative to a vacuum
(8.855 x 10-12Farads x m-1)
To compute the field voltage potential felt by the dielectric weuse the following logic.
Dielectric formation potential= Formation Ratio x
Working Voltage= 4 x 25
Formation Potential= 100 volts
Dielectric (Ta2O5) Thickness (d) is 1.7 x 10-9Meters Per Volt
d= 0.17 µmeters
Electric Field Strength= Working Voltage / d
= (25 / 0.17 µmeters)= 147 Kilovolts permillimeter
= 147 Megavoltsper meterNo matter how pure the raw tantalum powder or the precision of processing, there will always be impurity sites inthe dielectric. We attempt to stress these sites in the factorywith overvoltage surges, and elevated temperature burn inso that components will fail in the factory and not in yourproduct. Unfortunately, within this large area of tantalumpentoxide, impurity sites will exist in all capacitors.To minimize the possibility of providing enough activationenergy for these impurity sites to turn from an amorphousstate to a crystalline state that will conduct energy, seriesresistance and derating is recommended. By reducing theelectric field within the anode at these sites, the tantalumcapacitor has increased reliability. Tantalums differ from other electrolytics in that charge transients are carried byelectronic conduction rather than absorption of ions.
Question: What negative transients can Solid TantalumCapacitors operate under?
Answer: The reverse voltage ratings are designed to coverexceptional conditions of small level excursions into incorrectpolarity. The values quoted are not intended to cover contin-uous reverse operation. The peak reverse voltage applied tothe capacitor must not exceed:
10% of rated DC working voltage to a maximumof 1 volt at 25°C.
3% of rated DC working voltage to a maximum of0.5 volt at 85°C.
1% of category DC working voltage to a maximumof 0.1 volt at 125°C.
Question: I have read that manufacturers recommend aseries resistance of 0.1 ohm per working volt. You suggestwe use 1 ohm per volt in a low impedance circuit. Why?
Answer: We are talking about two very different sets of circuit conditions for those recommendations. The 0.1 ohmper volt recommendation is for steady-state conditions. Thislevel of resistance is used as a basis for the series resistancevariable in a 1% / 1000 hours 60% confidence level reference. This is what steady-state life tests are based on.The 1 ohm per volt is recommended for dynamic conditionswhich include current in-rush applications such as inputs topower supply circuits. In many power supply topologieswhere the di/dt through the capacitor(s) is limited, (such as most implementations of buck (current mode), forwardconverter, and flyback), the requirement for series resistanceis decreased.
Question: How long is the shelf life for a tantalum capacitor?Answer: Solid tantalum capacitors have no limitation onshelf life. The dielectric is stable and no reformation isrequired. The only factors that affect future performance ofthe capacitors would be high humidity conditions andextreme storage temperatures. Solderability of solder coatedsurfaces may be affected by storage in excess of one yearunder temperatures greater than 40°C or humidities greaterthan 80% relative humidity. Terminations should be checkedfor solderability in the event an oxidation develops on the solder plating.
Question: Do you recommend the use of tantalum capacitorson the input side of DC-DC converters?
Answer: No. Typically the input side of a converter is fedfrom the voltage sources which are not regulated and are ofnominally low impedance. Examples would be Nickel-Metal-Hydride batteries, Nickel-Cadmium batteries, etc., whoseinternal resistance is typically in the low milliohm range.
47
Technical Publications
1. Steve Warden and John Gill, “Application Guidelineson IR Reflow of Surface Mount Solid TantalumCapacitors.”2. John Gill, “Glossary of Terms used in the TantalumIndustry.”3. R.W. Franklin, “Over-Heating in Failed TantalumCapacitors,” AVX Ltd.4. R.W. Franklin, “Upgraded Surge Performance ofTantalum Capacitors,” Electronic Engineering 19855. R.W. Franklin, “Screening beats surge threat,”Electronics Manufacture & Test, June 19856. AVX Surface Mounting Guide7. Ian Salisbury, “Thermal Management of SurfaceMounted Tantalum Capacitors,” AVX
8. JohnGill, “Investigation into the Effects of ConnectingTantalum Capacitors in Series,” AVX9. Ian Salisbury, “Analysis of Fusing Technology forTantalum Capacitors,” AVX-Kyocera Group Company10. R.W. Franklin, “Analysis of Solid Tantalum Capacitor
Leakage Current,” AVX Ltd.
11. R.W. Franklin, “An Exploration of Leakage Current,”
AVX, Ltd.
12. William A. Millman, “Application Specific SMD
Tantalum Capacitors,” Technical Operations, AVX Ltd.13. R.W. Franklin, “Capacitance Tolerances for Solid
Tantalum Capacitors,” AVX Ltd.
14. Arch G. Martin,“Decoupling Basics,” AVX Corporation
15. R.W. Franklin, “Equivalent Series Resistance of
Tantalum Capacitors,” AVX Ltd.
16. John Stroud, “Molded Surface Mount Tantalum
Capacitors vs Conformally Coated Capacitors,” AVX Corporation, Tantalum Division
17. Chris Reynolds, “Reliability Management of Tantalum
Capacitors,” AVXTantalum Corporation
18. R.W. Franklin, “Ripple Rating of Tantalum Chip
Capacitors,” AVX Ltd.
19. Chris Reynolds, “Setting Standard Sizes for Tantalum
Chips,” AVX Corporation20. John Gill, “Surge In Solid Tantalum Capacitors,”
AVX Ltd.
21. David Mattingly, “Increasing Reliability of SMD
Tantalum Capacitors in Low Impedance Applications,”AVX Corporation
22. John Gill, “Basic Tantalum Technology,” AVX Ltd.23. Ian Salisbury, “Solder Update Reflow Mounting
TACmicrochip Tantalum Capacitor,” AVX Ltd.24. Ian Salisbury, “New Tantalum Capacitor Design for
0603 Size,” AVX Ltd.
25. John Gill, “Capacitor Technology Comparison,”
AVX Ltd.26. Scott Chiang, “High Performance CPU Capacitor
Requirements, how AVX can help,” AVX KyoceraTaiwan
27. John Gill and Ian Bishop, \"Reverse Voltage Behavior
of Solid Tantalum Capacitors.\"
As the world’s broadest line molded tantalum chip supplier, it is ourmission to provide First In ClassTechnology, Quality and Service,by establishing progressive design, manufacturing and continuousimprovement programs driving toward a single goal:
Total Customer Satisfaction.
Please contact AVX for application engineering assistance.
NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied.Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement andare not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required.Specifications are typical and may not apply to all applications.
48
Fax Back
For further information and sample availability.AVX USA: 843-626-5186AVX EUROPE:++44-1252-770004AVX ASIA:++65-3504-880Name:Company:Address:Zip Code:Tel. No:Fax No:Project launch date:ٗٗٗ0-3mths3-6mthsٗٗٗ6-12mthsٗٗٗٗٗٗϾ12mthsCircuit Application:DecouplingMarket Sector:TelecomsٗCellularTimingFilteringDC BlockingٗٗOtherAutoٗOtherPCStoragePower SupplyٗIndustrialPlease rank your critical design factors between 1-6 (1 most critical)ٗSizeMaxImpedanceTemperatureCapacitanceStabilityPlease specify any CV ratings required outside of current matrix:What other SMD products are used in this project:ٗٗٗٗLeakageCurrentٗHeightٗCeramicٗAluminumٗFilmٗChip ArraysٗConductivePolymerٗOs-conPlease specify any non standard special requirements:ٗNon Std CapLow ESRٗٗTemp1998ٗCap Tolerance1999ٗInterest in specials shown overleafof Short Form Catalog2000Forecast usage of Tantalum:Standard SMD TantalumTACmicrochipFavored Supplier, Please rank 1-5 (1 most favorable):ٗAVXHitachiٗKemetٗٗNECSpragueٗOtherٗOther engineers in your company who would like information:Please specify sample requirements:CAPACITANCEVOLTAGE49
USA
AVX Myrtle Beach, SCCorporate Offices
Tel: 843-448-9411FAX: 843-448-1943
AVX Northwest, WA
Tel: 360-669-8746FAX: 360-699-8751
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Tel: 317-848-7153FAX: 317-844-9314
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Tel: 508-485-8114FAX: 508-485-8471
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Tel: 408-436-5400FAX: 408-437-1500
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Tel: 602-539-1496FAX: 602-539-1501
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Tel: 972-669-1223FAX: 972-669-2090
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Tel: 919-878-6357FAX: 919-878-62
AVX Canada
Tel: 905-5-59FAX: 905-5-9728
EUROPE
ASIA-PACIFIC
AVX Limited, EnglandAVX/Kyocera, SingaporeEuropean Headquarters
Asia-Pacific Headquarters
Tel: ++44 (0)1252 770000Tel: (65) 258-2833FAX: ++44 (0)1252 770001
FAX: (65) 350-4880
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AVX/Kyocera, Hong Kong
Tel: ++33 (1) 69.18.46.00Tel: (852) 2-363-3303FAX: ++33 (1) 69.28.73.87
FAX: (852) 2-765-8185
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AVX/Kyocera, Korea
Tel: ++49 (0) 8131 9004-0Tel: (82) 2-785-6504FAX: ++49 (0) 8131 9004-44
FAX: (82) 2-784-5411
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Tel: ++49 (0) 2741 2990Tel: (886) 2-2516-7010FAX: ++49 (0) 2741 299133
FAX: (886) 2-2506-9774
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Tel: ++390 (0)2 614571Tel: (86) 21-6249-0314-16FAX: ++390 (0)2 614 2576
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Tel: ++420 (0)467 558340Tel: (60) 4-228-1190FAX: ++420 (0)467 558345
FAX: (60) 4-228-1196
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Tel: 045-943-2906/7FAX: 045-943-2910
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Tel: (81) 75-604-3426FAX: (81) 75-604-3425
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Tel: (81) 75-604-3424FAX: (81) 75-604-3425
Contact:A KYOCERA GROUP COMPANY
http://www.avxcorp.com
S-TSMT10M599-R
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