专利内容由知识产权出版社提供
专利名称：Modular connector system with high contact
element density
发明人：Laurentius M. Verhoeven申请号：US07/301381申请日：190125公开号：US04992052A公开日：19910212
摘要：A modular connector system wherein modules with high contact elementdensity may be surface mounted to a printed circuit board. The connector modulesachieve high contact element density by mutually displacing or offsetting the ends ofadjacent contact elements in the same column in the direction of the row which extendsin the longitudinal direction of the connector housing. The displaced ends are connectedby surface mounting means to contact surfaces on the printed circuit board. A uniquecontact design is disclosed which can be used also in cable and other types of connectors.The modules construction permits many and different types of connectors to bemounted readily to a printed circuit board.
申请人：E. I. DU PONT DE NEMOURS AND COMPANY
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