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专利名称：Apparatus and methods of testing and
assembling bumped devices using ananisotropically conductive layer
发明人：Salman Akram,Alan G. Wood,Warren M.
Farnworth
申请号：US09733572申请日：20001208公开号：US065097B2公开日：20030121
专利附图：
摘要：The present invention is directed toward apparatus and methods of testing and
assembling bumped die and bumped devices using an anisotropically conductive layer. Inone embodiment, a semiconductor device comprises a bumped device having a pluralityof conductive bumps formed thereon, a substrate having a plurality of contact padsdistributed thereon and approximately aligned with the plurality of conductive bumps,and an anisotropically conductive layer disposed between and mechanically coupled tothe bumped device and to the substrate. The anisotropically conductive layer electricallycouples each of the conductive bumps with a corresponding one of the contact pads.
申请人：MICRON TECHNOLOGY, INC.
代理机构：Dorsey & Whitney LLP
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