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专利名称：Multi-layer circuit board with fine pitches
and fabricating method thereof
发明人：Shih-Ping Hsu申请号：US11160413申请日：20050622
公开号：US20060131176A1公开日：20060622
专利附图：
摘要：A method for fabricating a multi-layer circuit board with fine pitch is provided.First, a plurality of contact pads is disposed on a core substrate. Next, a first dielectriclayer, a second dielectric layer, and a third dielectric layer are formed on the core circuit
board, in which a plurality of patterned openings are formed in the third dielectric layerand a plurality of vias is formed in the first and second dielectric layer, and the vias arelocated at the openings corresponding to the contact pads. Next, a conductive seed layeris disposed on the patterned openings and vias and a conductive layer is disposed on theconductive seed layer for forming circuit in each patterned opening and conductive via.Finally, removing the conductive layers and the conductive seed layer on the surface ofthird dielectric layer and forming a separation for each conductive circuit at each opening.
申请人：Shih-Ping Hsu
地址：Taoyuan County TW
国籍：TW
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